Abstract:Fibers are ubiquitous and usually passive. Optoelectronics realized in a fiber could revolutionize multiple application areas, including biosynthetic and wearable electronics, environmental sensing, and energy harvesting. However, the realization of high-performance electronics in a fiber remains a demanding challenge due to the elusiveness of a material processing strategy that would allow the wrapping of devices made in crystalline semiconductors, such as silicon, into a fiber in an ordered, addressable, and scalable manner. Current fiber-sensor fabrication approaches either are non-scalable or limit the choice of semiconductors to the amorphous ones, such as chalcogenide glasses, inferior to silicon in their electronic performance, resulting in limited bandwidth and sensitivity of such sensors when compared to a standard silicon photodiode. Our group substantiates a universal in-fiber manufacturing of logic circuits and sensory systems analogous to very large-scale integration (VLSI), which enabled the emergence of the modern microprocessor. We develop a versatile hybrid-fabrication methodology that assembles in-fiber material architectures typical to integrated microelectronic devices and systems in silica, silicon, and high-temperature metals. This methodology, dubbed "VLSI for Fibers," or "VLSI-Fi," combines 3D printing of preforms, a thermal draw of fibers, and post-draw assembly of fiber-embedded integrated devices by means of material-selective spatially coherent capillary breakup of the fiber cores. We believe that this method will deliver a new class of durable, low cost, pervasive fiber devices, and sensors, enabling integration of fabrics met with human-made objects, such as furniture and apparel, into the Internet of Things (IoT). Furthermore, it will boost innovation in 3D printing, extending the digital manufacturing approach into the nanoelectronics realm.

Flexible fibres take fabrics into the information age

High-quality semiconductor fibres via mechanical design

Semiconductor fibres for textile integrated electronic system

Thermally Drawn Advanced Functional Fibers: New Frontier of Flexible Electronics

Towards Digital Manufacturing of Smart Multimaterial Fibers

Future Thread: Printing Electronics on Fibers

Design and fabrication of wearable electronic textiles using twisted fiber-based threads

Ultra-fine self-powered interactive fiber electronics for smart clothing

Advanced Fiber Materials for Wearable Electronics

Towards woven logic from organic electronic fibres

Seamlessly-integrated Textile Electric Circuit Enabled by Self-connecting Interwoven Points

A fabrication process to reduce stress

Single body-coupled fiber enables chipless textile electronics

Design and Fabrication of Silk Templated Electronic Yarns and Applications in Multifunctional Textiles

A ‘Moore's law’ for fibers enables intelligent fabrics

Multifunctional Electronic Textiles by Direct 3D Printing of Stretchable Conductive Fibers

Design, fabrication and assembly considerations for electronic systems made of fibre devices

Diode fibres for fabric-based optical communications

Highly conductive and ultrastretchable electric circuits from covered yarns and silver nanowires.

Flexible Fiber Bioelectronic Composite Materials and Devices

Towards multimaterial multifunctional fibres that see, hear, sense and communicate