Oxidation behavior and interdiffusion of Ta Al multilayer films and Inconel 617 alloy

Yi-En Ke,Li-Chun Chang,Wu Kai,Yung-I Chen
DOI: https://doi.org/10.1016/j.surfcoat.2020.126684
IF: 4.865
2021-01-01
Surface and Coatings Technology
Abstract:<p>In this study, TaAl multilayer films were cosputtered on Inconel 617 through cyclical gradient concentration deposition. The oxidation behavior of the TaAl films and the interdiffusion between the TaAl films and Inconel 617 were evaluated through thermogravimetric analysis, X-ray diffraction, transmission electron microscopy, and Auger electron spectroscopy after the films were annealed in air at 400–800 °C. The results indicated that the Ta<sub>0.79</sub>Al<sub>0.21</sub> multilayer films had a low O content even though O diffused inward through the entire film thickness after 8 h of annealing at 800 °C, which was attributed to the formation of an Al oxide scale due to the outward diffusion of Al in the initial oxidation stage. This under-stoichiometric Al<sub>2</sub>O<sub>3</sub>/Ta<sub>2</sub>O<sub>5</sub> structure caused the produced films to exhibit a high hardness of 23.2 GPa and a high Young's modulus of 316 GPa. Moreover, the outward diffusion of Inconel 617 elements, namely Ni and Cr, was restricted by the oxidized films. However, the high Ta content in the TaAl films deteriorated the film adherence to the substrates due to a high volume ratio of Ta<sub>2</sub>O<sub>5</sub>/Ta. Furthermore, laminated Ta<sub>0.79</sub>Al<sub>0.21</sub>/Ta<sub>0.34</sub>Al<sub>0.66</sub>/Ti films were fabricated to improve the film–substrate adhesion. These films exhibited a high hardness of 17.1 GPa after annealing at 800 °C for 24 h.</p>
physics, applied,materials science, coatings & films
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