Abstract:Single-crystal silicon, a typical hard and brittle material, is widely used in various fields due to its exceptional material properties. However, grinding of silicon is facing great challenges such as surface and subsurface damages due to the hardness and brittleness of the material. To increase the grinding force ratio of tangential to normal force and enhance surface/subsurface quality during silicon grinding, a novel approach employing a newly developed body-armor-like abrasive tool (BAAT) with soft-hard combined substrate has been proposed to achieve high-shear and low-pressure grinding. The grinding principle of this new BAAT with its soft-hard combined substrate was interpreted in comparison to the previous BAAT. The influence of dimension parameters and material properties of the new BAAT on the contact region were analyzed using commercially available software, i.e., Abaqus. The optimal BAAT configuration with a soft-hard combined substrate was determined as elastomer hardness of 50 HA, wheel diameter of 120 mm, and elastomer thickness of 15 mm. Subsequent grinding tests were conducted to assess the performance in terms of surface roughness ( R a ), grinding force, and surface morphology using this newly developed BAAT under various conditions. With the new BAAT, the grinding force ratio, defined as the tangential force to the normal force, was calculated as 0.45. The optimum grinding conditions were identified as a feed rate of 500 mm/min, wheel velocity of 8 m/s, abrasive grain size of 0.5 μm, and abrasive mass fraction of 5%. Under the optimal conditions, the surface roughness ( R a ) of the workpiece decreased from 273.3 to 45.0 nm after 12 strokes with an improvement of 83.5%. It was observed that the deep pits and scratches of the initial workpiece surface were completely removed with relatively uniform grinding textures generated on the ground workpiece surface. The results demonstrated that high-shear and low-pressure grinding using the new BAAT was capable of attaining high-quality grinding for single-crystal silicon.

Study on high-shear and low-pressure grinding using a new BAAT with soft-hard combined substrate for single-crystal silicon

Studies on the Surface Quality of the Unsteady-State Grinding Technique

Observation in the Surface Roughness of Silicon Wafer During Semi-Fixed Abrasive Machining with Large Grains

Study on Preparation and Processing Properties of Mechano-Chemical Micro-Grinding Tools

Novel designed mechanical-mechanochemical synergistic micro-grinding technology and compounded abrasive micro-grinding tools

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

A new method for machining RB-SiC with high efficiency and quality: Laser assisted ultrasonic grinding

Study on the Fabrication and Grinding Performance of the Self-sharpening Cr2O3 Gel Abrasive Tool

Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness

Self-sharpening property of porous metal-bonded aggregated cBN wheels during the grinding of Ti–6Al–4V alloys

Modeling and experimental study on the grinding performance of precision diamond grinding tool with defined texture

A grinding force model in two-dimensional ultrasonic-assisted grinding of silicon carbide

Improved grinding performance of SiC using an innovative bionic vein-like structured grinding wheel optimized by hydrodynamics

Numerical simulation of single abrasive grain grinding of silicon carbide surface

Enhancing the grinding performance of RB-SiC ceramic using abrasive water jet dressed diamond grinding wheels

Investigation on surface generation mechanism of single-crystal silicon in grinding: Surface crystal orientation effect

Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard–Brittle Materials

Grain erosion wear properties and grinding performance of porous aggregated cubic boron nitride abrasive wheels

Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing

Mechanical effect of abrasives on silicon surface in chemo-mechanical grinding

Study on grinding performance during ultrasonic vibration-assisted grinding ultra-high strength steels