Abstract:Cluster tools play a significant role in the entire process of wafer fabrication. As the width of circuits in semiconductor chips shrinks down to less than 10nm, strict operational constraints are imposed on the operations of cluster tools in order to ensure the quality of processed wafers. Particularly, wafer residency time constraints and chamber cleaning requirements are commonly seen in etching, chemical vapor deposition, coating processes, etc. They make the scheduling problem of cluster tools more challenging. This work aims to provide a solution for dual-arm cluster tools with wafer residency time constraints and chamber cleaning requirements. To do so, it proposes a novel virtual wafer-based scheduling method. By this method, under a steady state, a PM processes either a real or virtual wafer at a time. When a PM processes a virtual one, its chamber can perform a cleaning operation. In this way, we can meet not only the strict residency time constraints for real wafers, but also innovatively meet chamber cleaning requirements. Based on such a novel scheduling method, an efficient binary integer programming model is established to optimize the throughput of cluster tools. Finally, experiments are performed to show the efficiency and effectiveness of the proposed method. Note to Practitioners—To ensure wafer quality in semiconductor manufacturing, engineers have to impose wafer residency time constraints and chamber cleaning requirements on the operations of cluster tools. In order to tackle their scheduling problem with these constraints, this work proposes a novel method based on the use of virtual wafers. Under a one-cyclic schedule obtained for time-constrained cluster tools without chamber cleaning requirements, virtual wafers are loaded into the tool such that when a PM processes a virtual wafer, a chamber cleaning operation can be performed in practice. The key to solve this scheduling problem is to find a wafer loading sequence with the highest performance in terms of cycle time. To do so, this work establishes an efficient binary integer programming model to search for such a solution. Since the obtained solution is a periodical wafer loading sequence based on a one-wafer cyclic schedule, it can be easily implemented. Therefore, this work has a high practical value to numerous semiconductor manufacturers.

Cleaning Plan Optimization for Dual-Armed Cluster Tools With General Chamber Cleaning Periods

Scheduling of Single-Arm Cluster Tools with Residency Time Constraints and Chamber Cleaning Operations

Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types

An Order Releasing Algorithm for a Semiconductor Wafer Manufacturer

An Efficient Binary Integer Programming Model for Residency Time-Constrained Cluster Tools With Chamber Cleaning Requirements

Optimally Scheduling Dual-Arm Multi-Cluster Tools to Process Two Wafer Types

Wafer Delay Minimization in Scheduling Single-Arm Cluster Tools with Two-Space Process Modules

Cyclic scheduling of cluster tools with equipment front-end module and multifunctional load locks

Transient Process Optimization for Dual-Arm Cluster Tools With Wafer Revisiting

Periodic Scheduling Optimization for Dual-Arm Cluster Tools with Arm Task and Residency Time Constraints via Petri Net Model

Feedback Control of Cluster Tools: Stability Against Random Time Disruptions

Virtual Cell-Based Scheduling Approach to Single-Robotic-Arm Cluster Tools Subject to Wafer Residency Time Constraints

Low-Carbon Disassembly Sequence Planning with Improved Moth-Flame Optimizer by Considering Non-homogeneous Information in Industry 5.0

Sequence Planning for Selective Disassembly Aiming at Reducing Energy Consumption Using a Constraints Relation Graph and Improved Ant Colony Optimization Algorithm

Real-Time Scheduling and Control of Single-Arm Cluster Tools With Residency Time Constraint and Activity Time Variation by Using Resource-Oriented Petri Nets

Cyclic Scheduling of Multi-Cluster Tools Based on Mixed Integer Programming

Cyclic Scheduling of Multi-Cluster Tools Based on Equivalent Processing Modules

Noncyclic Scheduling of Multi-Cluster Tools with Residency Constraints Based on Pareto Optimization

Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm

Clogging monitoring and regeneration of filtration film in wafer cleaning circulation systems for semiconductor manufacturing

A Low Cost and Residue-Free Abrasive-Free Copper Cmp Process with Low Dishing, Erosion and Oxide Loss