Feedback Control of Cluster Tools: Stability Against Random Time Disruptions

Chulhan Kim,Tae-Sun Yu,Tae-Eog Lee
DOI: https://doi.org/10.1109/tase.2021.3070346
IF: 6.636
2021-01-01
IEEE Transactions on Automation Science and Engineering
Abstract:In this research, we examine feedback control-based cluster tool scheduling methods to maintain consistent wafer sojourn times when a tool is subject to random disruptive events. In our previous work, we proposed a feedback control design that regulates wafer sojourn times not to exceed the upper limits on wafer delays in a deterministic processing environment. Although such a feedback controller may ensure that wafer delay upper limits are always satisfied, it does not necessarily guarantee that the tool always restores its initial tool state after the occurrence of time disruptive events. This article thus further examines under which conditions a feedback controller enforces the wafer sojourn times to be stabilized in a stochastic processing environment with unexpected random time disruptions. Note to Practitioners—In semiconductor manufacturing, excessive wafer sojourn times at wafer fabrication tools increase the risk of wafer quality failures. In particular, the wafer quality fluctuates when the sojourn times are inconsistent over different wafers. Therefore, in cluster tools, wafer sojourn times are often strictly regulated to be minimized or to remain constant with an objective of reducing the risk of wafer quality degradation. In this research, we examine a cluster tool scheduling framework that enables to maintain stable tool operations even when a tool is randomly disrupted by unexpected exceptional events.
automation & control systems
What problem does this paper attempt to address?
The paper attempts to address the issue of how to maintain the stability of a Cluster Tool in the semiconductor manufacturing process through feedback control methods when faced with random time interruption events. Specifically, the authors focus on ensuring that the sojourn times of wafers in various processing modules remain consistent when the Cluster Tool experiences unexpected time disturbances, thereby reducing the risk of wafer quality fluctuations. ### Detailed Explanation: 1. **Background**: - In semiconductor manufacturing, prolonged sojourn times of wafers in the Cluster Tool increase the risk of wafer quality issues. - A Cluster Tool is an enclosed vacuum environment used for various wafer processing steps, which can reduce wafer quality issues associated with batch processing tools. - Random time interruption events (such as maintenance operations, chamber failures, or robot malfunctions) can affect the normal operation of the Cluster Tool. 2. **Problem Description**: - When the Cluster Tool is affected by random time interruption events, existing feedback controllers can ensure that the sojourn times of wafers do not exceed a set upper limit but cannot guarantee that the tool will return to its initial state after the interruption. - This instability can lead to variations in wafer quality distribution, even if the sojourn times still meet the constraint conditions. 3. **Research Objective**: - This paper aims to explore how to design a feedback controller to maintain the stability of the Cluster Tool, i.e., to return to the initial scheduling mode after random time interruption events. - The authors hope to find a scheduling strategy that ensures the stability of the Cluster Tool after random time interruption events, thereby preventing wafer quality fluctuations. 4. **Main Contributions**: - Propose a feedback control design that allows the Cluster Tool to return to the initial scheduling mode after random time interruption events. - Prove that there exists a feedback control design that can meet stability conditions. - Provide a specific feedback control design scheme through theoretical analysis and model validation to ensure the stable operation of the Cluster Tool after random time interruption events. ### Conclusion: This paper addresses the stability issue of the Cluster Tool when faced with random time interruption events by proposing a new feedback control method, thereby reducing the risk of wafer quality issues. This research is of significant importance for improving the reliability and efficiency of the semiconductor manufacturing process.