Abstract:We examine a scheduling problem for a dual-armed cluster tool that processes multiple similar wafer types concurrently. It has been recently proved that the well-known swap sequence, which is widely used for single wafer type processing, also minimizes the cycle time for concurrent processing. In this article, we wish to minimize wafer delays in a process chamber, which are critical to wafer quality degradation, while maintaining the minimum cycle time. In particular, we show that concurrent processing of wafers with different processing times complicates the analysis of wafer delays significantly, and the wafer delays can be remarkably reduced by finding a proper cycle plan which is the release sequence of different wafer types. We first characterize wafer delays for a given cycle plan by analyzing the circuits of the timed event graph (TEG) model. From this, we prove that concurrent processing of wafers may cause a significant workload imbalance between parallel chambers of a process step, and hence the wafer delays increase substantially. We present that the wafer delays are minimized by a cycle plan that evenly balances workloads between parallel chambers. We also propose how wafer loading task at each process step has to be postponed to meet wafer delay constraints while maintaining the minimum cycle time. Note to Practitioners—Wafer quality control has become an essential fab operational problem in semiconductor manufacturing industry. In cluster tools, which are dominantly being used for diverse wafer fabrication stages, it has been proven that the wafer delays within process chambers have a crucial impact on the wafer quality. Accordingly, modern fabs have introduced stringent quality control to regulate wafer delays in cluster tools. In this research, we propose a scheduling strategy to minimize the wafer delays when a cluster tool concurrently processes multiple wafer types. We first show that the release sequence of di-ferent wafer types significantly impacts the wafer delays under concurrent processing, and we then propose how these wafer delays can be minimized by finding the optimal wafer release sequence.

Optimally Scheduling Dual-Arm Multi-Cluster Tools to Process Two Wafer Types

Scheduling Single-Arm Multicluster Tools for Two-Type Wafers with Lower-Bound Cycle Time

Optimally Scheduling Single-Arm Multicluster Tools for Manufacturing Hybrid-Type Wafers

Scheduling Dual-Arm Multi-Cluster Tools With Regulation of Post-Processing Time

Scheduling of Single-Arm Multi-cluster Tools with Wafer Residency Time Constraints in Semiconductor Manufacturing

Scheduling and Optimization of Mixed-Processing with Multi-Variety Wafers in Dual-Armed Cluster Tools

Schedulability Analysis for Dual-Armed Cluster Tools with Mixed-Processing of Multi-Variety Wafers

Optimal Integrated Schedule of Entire Process of Dual-Blade Multi-Cluster Tools from Start-Up to Close-Down

Scheduling Of Single-Arm Multi-Cluster Tools To Achieve The Minimum Cycle Time

Multiobjective Scheduling of Dual-Blade Robotic Cells in Wafer Fabrication

Scheduling method for dual-blade multi-cluster tools with residency constraints

Petri Net-Based Optimal One-Wafer Scheduling of Single-Arm Multi-Cluster Tools in Semiconductor Manufacturing

Scheduling a Single-Arm Two-Cluster Tool with a Process Module Failure Subject to Wafer Residency Time Constraints

Scheduling Transient Processes for Time-Constrained Single-Arm Robotic Multi-Cluster Tools

Noncyclic Scheduling of Multi-cluster Tools with Multi-type Wafers Based on Pareto Optimization

Wafer Delay Minimization in Scheduling Single-Arm Cluster Tools with Two-Space Process Modules

Scheduling of Single-Arm Cluster Tools with Residency Time Constraints and Chamber Cleaning Operations

Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types

Close-down process scheduling of wafer residence time-constrained multi-cluster tools

An Equivalent Conversion Method for Dual-Armed Multi-Cluster Tool Scheduling Problems with Multi-Wafer Types

Post-processing Time-Aware Optimal Scheduling of Single Robotic Cluster Tools