Thermoelectric Performance Enhancement in Commercial Bi 0.5 Sb 1.5 Te 3 Materials by Introducing Gradient Cu-Doped Grain Boundaries

Shuankui Li,Wenguang Zhao,Yajuan Cheng,Lei Chen,Mengxin Xu,Kai Guo,Feng Pan
DOI: https://doi.org/10.1021/acsami.2c18575
2022-12-23
Abstract:ACS Appl Mater Interfaces . 2022 Dec 22. doi: 10.1021/acsami.2c18575. Online ahead of print. NO
materials science, multidisciplinary,nanoscience & nanotechnology
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