Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level

Gerald Pasdast,Debendra Das Sharma,K. Aygun,Z. Qian
DOI: https://doi.org/10.1109/TCPMT.2022.3207195
2022-09-01
Abstract:Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for developing an open chiplet ecosystem, where chiplets from any supplier can be packaged anywhere in an interoperable manner. This article delves into the architectural, circuit, channel, and packaging aspects that we developed that has been adopted in the UCIe 1.0 Specification. We present our results based on our channel and circuit implementation studies.
Engineering,Computer Science
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