Abstract:Chiplet-based design, which breaks a system into multiple smaller dice (or “chiplets”) and reassembles them into a new system chip through advanced packaging, has received extensive attention in the post Moore’s law era due to its advantages in terms of cost, performance, and agility. However, significant challenges arise in this implementation approach, including the mapping of functional components onto chiplets, co-optimization of package and architecture, handling the increased latency of communication across functions in different dies, the uncertainty problems of fragment communication subsystems, such as maintaining deadlock-free when independently designed chiplets are combined. Despite various design approaches that attempt to address these challenges, surveying these approaches one-after-another is not the most helpful way to offer a comparative viewpoint. Accordingly, in this paper, we present a more comprehensive and systematic strategy to survey the various approaches. First, we divide them into chiplet-based system architecture design and interconnection design, and further classify them based on different architectures and building blocks of interconnection. Then, we analyze and cross-compare each classification separately, and in addition, we present a topical discussion on the evolution of memory architectures, design automation, and other relevant topics in chiplet-based designs. Finally, some discussions on important topics are presented, emphasizing future needs and challenges in this rapidly evolving field.

RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures

Automated Design of Chiplets

Floorplet: Performance-aware Floorplan Framework for Chiplet Integration

PAD: A Design Space Exploration Model for Reconfigurable Systems

Modular High-Performance Computing Using Chiplets

CHIPKIT: An agile, reusable open-source framework for rapid test chip development

Massive Data-Centric Parallelism in the Chiplet Era

Chiplets and the Codelet Model

Furthering Moore’s Law Integration Benefits in the Chiplet Era

Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies

Chiplets on Wheels: Review Paper on Holistic Chiplet Solutions for Autonomous Vehicles

HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement

Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly

Chiplet Actuary: A Quantitative Cost Model and Multi-Chiplet Architecture Exploration

A Multi-Chiplet Computing-in-Memory Architecture Exploration Framework Based on Various CIM Devices

Review of Chiplet-Based Design: System Architecture and Interconnection

The Decomposition and Combination Paradigms of Chiplet-Based Integrated Chips

A Scalable Methodology for Designing Efficient Interconnection Network of Chiplets

Evaluating Chiplet-based Large-Scale Interconnection Networks Via Cycle-Accurate Packet-Parallel Simulation.

Security Assessment of Interposer-based Chiplet Integration

A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D Heterogeneous Integration.