Modern Trends in Microelectronics Packaging Reliability Testing

Emmanuel Bender,Joseph B. Bernstein,Duane S. Boning

DOI: https://doi.org/10.3390/mi15030398

IF: 3.4

2024-03-16

Micromachines

Abstract:In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied

What problem does this paper attempt to address?

The paper primarily explores modern trends in microelectronic packaging reliability and its testing methods. Specifically, the research aims to address the following key issues:

1. **Reliability Challenges Brought by Advanced Packaging Technologies**: With the advancement of semiconductor technology, especially the development of high-density heterogeneous integration (HI) technologies such as 2.5D/3D IC packaging, new packaging forms (e.g., 3D stacking, silicon interposers, fan-out packaging, etc.) have introduced unprecedented reliability issues. These new packaging technologies have wide applications in automotive, industrial, and cloud computing fields, making it crucial to ensure their reliability.

2. **Multi-Material Characteristics of Packaging Materials and Structures**: Microelectronic packaging typically involves multiple different materials, complicating the assessment of their performance and reliability. The research needs to conduct an in-depth analysis of the interactions between different materials and design effective testing schemes to simulate various stress conditions in actual use.

3. **Predicting Packaging Reliability**: To effectively predict the reliability of packaging, it is necessary to establish models based on physical failure mechanisms. These models can help understand the mechanisms of different failure modes and predict the mean time between failures (MTBF) of the packaging through accelerated life testing and other means.

4. **Improving Testing Methods**: The research proposes a methodology based on a pyramid model to guide the entire testing process from identifying material vulnerabilities to ultimately forming a comprehensive reliability profile. This approach emphasizes the importance of selecting appropriate test cases under different stress modes to activate and observe different failure mechanisms.

In summary, the core objective of this paper is to summarize existing packaging reliability testing methods and provide an effective set of testing strategies for future advanced packaging technologies. Through these strategies, it is possible to better understand and predict the reliability issues of new packaging technologies, thereby supporting the design and development of high-performance microelectronic devices.