Simultaneously enhanced thermal conductivity and dielectric properties of borosilicate glass-based LTCC with AlN and h-BN additions

Shuquan Yang,Lan Zhang,Meihui Xiao,Lin Chen,Jun Sun,Jianjun Ding,Xiaoxiao Li,Yi Gong,Kang Zheng,Xian Zhang,Xingyou Tian

DOI: https://doi.org/10.1016/j.jeurceramsoc.2023.04.013

IF: 5.7

2023-04-16

Journal of the European Ceramic Society

Abstract:Microwave devices with reduced dielectric loss and electronic components with increased integration density necessitate the higher performance of electronic packaging materials. The h-BN/AlN/CaCO 3 -MgO-B 2 O 3 -SiO 2 -Li 2 CO 3 glass composites were prepared via tape-casting and then sintered by pressureless and hot-pressing, respectively. The thermal conductivity of pressureless sintered composite was increased to 6.55 W/(m·K) by incorporating 3 wt% h-BN, and the thermal expansion of 4.47 ppm/K was achieved along with low dielectric constant of 5.76 and dielectric loss of 7.02 × 10 −4 at 24 GHz. In contrast, the hot-pressing sintered composite containing 4 wt% h-BN exhibited higher thermal conductivity of 10.3 W/(m·K) and lower dielectric loss of 4.77 × 10 −4 . The microstructure characterization indicated the construction of heat conduction networks, and XRD analysis illustrated the formation of crystallization in the glass. Such low-temperature co-fired ceramic (LTCC) with high thermal conductivity and low dielectric loss would be a promising candidate for electronic packaging and 5G communication applications.

materials science, ceramics