EUV lithography vacuum system energy and footprint reduction

Richard Salloum,Zhen Ma,A. Keen,Jimmy Feng,Hui Ji
DOI: https://doi.org/10.1109/IWAPS57146.2022.9972330
2022-10-21
Abstract:The semiconductor industry, like many others, must face numerous sustainability challenges. From an environmental view, these include waste and the circular economy, water use, air pollution, global warming and climate change, and energy use. These topics are interdependent. This paper will discuss the challenges of vacuum and abatement on the EUV process, and how to reduce the footprint and energy usage of EUV Zenith. The SEMI S23 guidelines provide a means to capture the many energies uses by a fab for operating semiconductor manufacturing equipment and the associated facilities. Energy conversion factors (ECF) are provided, and operational modes such as process, idle, rest, and sleep modes are needed to perform equivalent energy calculations. Calculating the impact of equipment modification on the energy used by the equipment itself and any associated support utilities is possible.The combination of direct and indirect emissions for energy comprises the carbon footprint. The conversion of the SEMI S23 derived energy to carbon footprint requires knowledge of the carbon intensity of the electricity used by the fab (in kg/kWh) and any carbon dioxide or other greenhouse gases direct emissions during the abatement process. In transitioning from our first-generation EUV vacuum system to our third generation EUV vacuum system, we estimated a 49% saving in energy requirements. The former included a gas-fired abatement, the latter a hydrogen recycle system. Field measurements have now confirmed this estimate. This paper will discuss the numerous changes made in moving from EUV Zenith Generation 1 to Generation 3, the impacts on the equivalent energy and carbon footprint, and the improvements to the equipment footprint.
Environmental Science,Engineering
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