Influence of Substrate Temperature and Film Thickness on Thermal, Electrical, and Structural Properties of HPPMS and DC Magnetron Sputtered Ge Thin Films

A. Furlan,A. Ludwig,G. Pernot,Dario Grochla,S. Dilhaire,Quentin d'Acremont
DOI: https://doi.org/10.1002/adem.201600854
2017-05-01
Abstract:Ge was deposited as thickness gradient films at temperatures up to 800 °C by direct current (DC) and high power pulsed magnetron sputtering (HPPMS). Structural characterization shows increased crystallization with increasing substrate temperature and film thickness. Thermal conductivity was measured by a novel high‐throughput time‐domain thermo‐reflectance method. Thermo‐electrical properties correlate to the degree of crystallization. Conductivities increase with increasing substrate temperature up to 500 °C. For higher temperatures the trend reverses. A room temperature deposited/annealed film displays smaller crystallites (10 nm) and lower thermal conductivity (5 Wm−1 K−1) compared to 25 Wm−1 K−1 for hot DC deposition. Compared to DC, HPPMS films show higher thermal conductivities up to 45 Wm−1 K−1.
Engineering,Materials Science,Physics
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