Cross-scale numerical analysis of PCB lamination process by an innovative partitioned homogenization method for the non-uniform curing shrinkage effect
Guoshun Wan,Qi Dong,Xiaochen Sun,Hao Zheng,Mengxuan Cheng,Zhiyan Zhao,Yuxi Jia
DOI: https://doi.org/10.1016/j.microrel.2024.115325
IF: 1.6
2024-01-31
Microelectronics Reliability
Abstract:This study introduces a cross-scale numerical analysis approach for modeling the lamination process and predicting the post-lamination warping deformation of Printed Circuit Boards (PCBs), utilizing the partitioned homogenization methodology to account for the mesoscopic structure of each conductive layer. The curing reaction and viscoelastic properties of the resin are also taken into account and an investigation on the partitioned homogenization methodology of the resin's curing-induced shrinkage effect is conducted. Furthermore, an innovative partitioned homogenization method to deal with the non-uniform curing shrinkage effect of the conductive layers is proposed in this paper, by assigning the calculated homogenized curing shrinkage strain of conductive layers to their adjacent prepreg layers. When aligned with experimental data on the temperature distribution and evolution during lamination and the post-lamination warping deformation, the numerical predictions are found to be accurate. This affirms that the proposed approach emerges as an accurate predictor of PCB post-lamination warping deformation, thereby enhancing the design efficiency and quality of reliability analysis. Additionally, the proposed approach shows promise for broad application in microelectronics where addressing non-mechanical strains in conductive layers is crucial.
engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied