Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys

Yixian Liu,Shoumei Xiong

DOI: https://doi.org/10.3390/met14040370

IF: 2.695

2024-03-23

Metals

Abstract:High-pressure die casting (HPDC) has been extensively used to manufacture aluminum alloy heat dissipation components in the fields of vehicles, electronics, and communication. With the increasing demand for HPDC heat dissipation components, the thermal conductivity of die-cast aluminum alloys is paid more attention. In this paper, a comprehensive review of the research progress on the thermal conductivity of HPDC aluminum alloys is provided. First of all, we introduce the general heat transport mechanism in aluminum alloys, including electrical transport and phonon transport. Secondly, we summarize several common die-cast aluminum alloy systems utilized for heat dissipation components, such as an Al–Si alloy system and silicon-free aluminum alloy systems, along with the corresponding composition optimizations for these alloy systems. Thirdly, the effect of processing parameters, which are significant for the HPDC process, on the thermal conductivity of HPDC aluminum alloys is discussed. Moreover, some heat treatment strategies for enhancing the thermal conductivity of die-cast aluminum alloys are briefly discussed. Apart from experimental findings, a range of theoretical models used to calculate the thermal conductivity of die-cast aluminum alloys are also summarized. This review aims to guide the development of new high-thermal-conductivity die-cast aluminum alloys.

materials science, multidisciplinary,metallurgy & metallurgical engineering

What problem does this paper attempt to address?

The main focus of this paper is the research progress on thermal conductivity of high pressure die casting (HPDC) aluminum alloys. With the increasing demand for heat dissipation components in HPDC, the thermal conductivity of aluminum alloys has received more attention. The paper reviews the general mechanisms of heat transfer in aluminum alloys, including electron transport and phonon transport, and discusses in detail several common die casting aluminum alloy systems used for heat dissipation components, such as Al-Si alloy system and silicon-free aluminum alloy system, as well as the composition optimization of these alloy systems. In addition, the paper explores how processing parameters (critical for HPDC process) affect the thermal conductivity of aluminum alloys, as well as the heat treatment strategies to enhance the thermal conductivity of die casting aluminum alloys. Furthermore, the paper summarizes various theoretical models used to calculate the thermal conductivity of die casting aluminum alloys. Its goal is to guide the development of new high thermal conductivity die casting aluminum alloys.

Research Progress on Thermal Conductivity of High-Pressure Die-Cast Aluminum Alloys

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