Construction of [P4442]2[IDA]/Zirconium Metal‐Organic Framework (UiO‐66) for Curing with Epoxy Resin

Zhiwei Fan,Yilin Ma,Encheng Liu,Junjie Cheng,Fengfeng Chen,Bin Ling,Ningyu Di,Junkuo Gao
DOI: https://doi.org/10.1002/zaac.202400031
2024-05-10
Zeitschrift für anorganische und allgemeine Chemie
Abstract:Curing agents for epoxy resin (EP) are one of the most important branches in the polymer materials field due to their enormous potential in many fields, but constructing them in a well‐controlled curing temperature remains challenging. Herein, a novel curing agent is constructed by the zirconium metal‐organic framework (UiO‐66) and [P4442]2[IDA] through an impregnation method. [P4442]2[IDA]@UiO‐66 is utilized as a functional nanofiller and curing agent to construct the [P4442]2[IDA]@UiO‐66/EP nanocomposites. The chemical structures of [P4442]2[IDA]@UiO‐66 were investigated by XRD, SEM, DSC, and TG characterizations. The various [P4442]2[IDA]@UiO‐66 with different loading amounts of [P4442]2[IDA] were used to investigate the curing behaviors of the EP‐51. The DSC results confirm that the curing temperature of the [P4442]2[IDA]@UiO‐66/EP is higher than that of [P4442]2[IDA]/EP. In addition, the kinetic parameters and the activation energy of the curing reaction were acquired according to the fitting of Kissinger equation and Ozawa equation. The drying time of [P4442]2[IDA]@UiO‐66/EP system at 40 °C was enhanced 17 times compare to that of [P4442]2[IDA]/EP system. This study opens new avenues for the rational design of EP nanocomposites by employing ionic liquids@MOFs composite materials as curing agent for wide engineering applications.
chemistry, inorganic & nuclear
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