Abstract:Understanding the initiating and suppression mechanisms of existing defects are the key to optimizing the ultra-precision grinding process of hard and brittle materials. This paper discusses the effects of grinding damage on material removal mechanism from the perspectives of residual scratch depth, scratch morphology and normal scratching force, through conducting the contrast variable-depth nano-scratch experiment on polished and ground monocrystalline silicon and establishing the single grain scratching Smoothed Particle Hydrodynamics (SPH) model. The experimental and simulation results show that radial crack on ground silicon surface is almost invisible due to the existence of grinding marks, which indicates that it is difficult to judge the ductile brittle transition (DBT) point by the traditional method of observing cracks. With the increase of penetration depth, pop-in will occur in the residual scratch depth of polished and ground silicon, indicating that the material removal mode has transformed, which provides an important basis for judging the DBT point. The DBT critical normal scratching force (38.93 mN) and residual scratch depth (−0.14 μm) of ground silicon are much higher than those of polished silicon, implying ground silicon is easier to achieve ductile processing. Meanwhile, when the penetration depth is the same, compared to polished silicon, the normal scratching force of ground silicon is generally larger. Finally, a single grain scratching SPH model of pre-stressed silicon is established. And the simulated phenomenon and conclusions are consistent with the experiment, which proves that the surface compressive stress is an important factor that causes the removal characteristics of ground silicon to be different from polished silicon. This study provides a theoretical basis for understanding the ultra-precision grinding removal mechanism of hard and brittle materials.

Study on the removal mechanism of Si3N4 ceramic material in rotary ultrasonic grinding based on multi-abrasive coupling simulation

An Experimental Investigation on Ultrasonic Vibration-Assisted Grinding of Sio2f/Sio2 Composites

Effect of Ultrasonic Vibration Assisted Grinding Process on Surface Topography and Properties of C/SiC Composite

Numerical simulation of single abrasive grain grinding of silicon carbide surface

Impact of multiple abrasive particles on surface properties of SiC: A molecular dynamics simulation study

Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Investigation on the machined surface quality and removal mechanism of SiCf/SiC composites in ultrasonic-assisted grinding

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Material Removal Mechanism of SiC Ceramic by Porous Diamond Grinding Wheel Using Discrete Element Simulation

Experimental Investigation On Surface High Temperature Wear Behaviors Of Si3n4 Ceramics For Rotary Ultrasonic Grinding

Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations

Kinematics and Simulation Analysis of Longitudinal-Torsional Ultrasonic Assisted Grinding of Zirconia Ceramics

Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics

Grinding force modeling in ultrasonic-assisted face grinding of ZrO2 ceramics and influence of grinding wheel wear on its accuracy

Diamond wheel grinding characteristics of 3D orthogonal quartz fiber reinforced silica ceramic matrix composite

Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal

Research on Material Removal Mechanism of C/SiC Composites in Ultrasound Vibration-Assisted Grinding

Study on the removal mechanism in multi-abrasive micro-grinding of nickel-based superalloy

Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude

Study on surface/subsurface breakage in ultrasonic assisted grinding of C/SiC composites