Abstract:Manipulating materials with atomic-scale precision is essential for the development of next-generation material design toolbox. Tremendous efforts have been made to advance the compositional, structural, and spatial accuracy of material deposition and patterning. The family of 2D materials provides an ideal platform to realize atomic-level material architectures. The wide and rich physics of these materials have led to fabrication of heterostructures, superlattices, and twisted structures with breakthrough discoveries and applications. Here, we report a novel atomic-scale material design tool that selectively breaks and forms chemical bonds of 2D materials at room temperature, called atomic-layer substitution (ALS), through which we can substitute the top layer chalcogen atoms within the 3-atom-thick transition-metal dichalcogenides using arbitrary patterns. Flipping the layer via transfer allows us to perform the same procedure on the other side, yielding programmable in-plane multi-heterostructures with different out-of-plane crystal symmetry and electric polarization. First-principle calculations elucidate how the ALS process is overall exothermic in energy and only has a small reaction barrier, facilitating the reaction to occur at room temperature. Optical characterizations confirm the fidelity of this design approach, while TEM shows the direct evidence of Janus structure and suggests the atomic transition at the interface of designed heterostructure. Finally, transport and Kelvin probe measurements on MoXY (X,Y=S,Se; X and Y corresponding to the bottom and top layers) lateral multi-heterostructures reveal the surface potential and dipole orientation of each region, and the barrier height between them. Our approach for designing artificial 2D landscape down to a single layer of atoms can lead to unique electronic, photonic and mechanical properties previously not found in nature.

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Deterministically self-assembled 2D materials and electronics

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A General Strategy for Designing Two-Dimensional High-Efficiency Layered Thermoelectric Materials

Modulating Vectored Non-Covalent Interactions for Layered Assembly with Engineerable Properties

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Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

Facile fabrication of 2D material multilayers and vdW heterostructures with multimodal microscopy and AFM characterization

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Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses.

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Thin-suspended 2D Materials: Facile, Versatile, and Deterministic Transfer Assembly

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Tailoring the mechanical properties of 2D materials and heterostructures

Strategy for transferring van der Waals materials and heterostructures

Vertical Integration of 2D Building Blocks for All‐2D Electronics

Interlayer coupling in two-dimensional semiconductor materials

Facing the key challenges of two-dimensional electronics