Abstract:Advances in modern electronic technologies have been driven toward combining the continued miniaturization of device components and their deterministic integration onto unconventional platforms. This effort aims at achieving electronic devices of various form factors with exotic functionalities, which has been foreseen to be impossible with any traditional approaches. Amongst a variety of 'futuristic' technologies, mechanically reconfigurable devices which can be reversibly stretched, twisted, and folded under severe mechanical deformation and harsh operational conditions offer an enormous amount of unprecedented opportunities. Traditional device manufacturing schemes have relied on three-dimensional silicon (Si)-based wafers, which are intrinsically bulky and rigid, requiring highly complicated and unstainable fabrication steps for the inclusion of such mechanical deformability. This fundamental challenge invokes innovations in materials design and processing, triggering to explore a new type of electronic materials that can intrinsically possess superior materials properties even at extremely small length-scales. Recently discovered two-dimensional (2D) transition metal dichalcogenides (TMDs) offer a rich set of unparalleled properties in a wide range of optical, electrical, and mechanical aspects unattainable with Si. Moreover, they offer uniquely suited advantages for mechanically reconfigurable electronics owing to their extremely large mechanical tolerance and small thickness coupled with van der Waals attraction-enabled relaxed assembly requirement. In this review, we report an extensive overview of up-to-date progress in exploring 2D TMD layers for mechanically reconfigurable electronic devices, particularly focusing on large-area devices by noting their technological and practical relevance. We systematically overview the material property suitability of 2D TMD layers for reconfigurable electronics and their fabrication and integration strategies as well as proof-of-concept demonstrations available in the literature. We also discuss current technical challenges associated with developing high-performance 2D TMD-based devices and offer forward-looking perspectives for this emerging technology.

Deterministically self-assembled 2D materials and electronics

Mechanical Self-Assembly Technology for 2D Materials

Freestanding 3D Mesostructures, Functional Devices, and Shape‐Programmable Systems Based on Mechanically Induced Assembly with Shape Memory Polymers

Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

Small Transition-Metal Dichalcogenide Nanostructures Down to Subnanometer by Two-Dimensional Material Origami

A clever trilayer assembly strategy for 2D materials

Programmable 2D materials through shape-controlled capillary forces

Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses.

Self-assembly and Modulation of the Physical Properties of Functional Nanostructures

Millimeter-Sized Two-Dimensional Molecular Crystalline Semiconductors with Precisely Defined Molecular Layers via Interfacial-Interaction-Modulated Self-Assembly.

Large-scale Chemical Assembly of Atomically Thin Transistors and Circuits

Deterministic Thermal Sculpting of Large-Scale 2D Semiconductor Nanocircuits

Exploring Two-Dimensional Materials toward the Next-Generation Circuits: From Monomer Design to Assembly Control

Chemical assembly of atomically thin transistors and circuits in a large scale

Tailoring Self-Assembly of Alternating Copolymers for Ordered and Crystalline 2D Nanostructures Via Diverse Strategies

Shaping and Structuring 2D Materials Via Kirigami and Origami

Capillary‐Force‐Driven Self‐Assembly of 4d‐printed Microstructures

Self-Assembly of Two-Dimensional Nanosheets into One-Dimensional Nanostructures

Mechanical Assembly of Complex, 3D Mesostructures from Releasable Multilayers of Advanced Materials

Fluidic Flow Assisted Deterministic Folding of Van der Waals Materials

Large-area 2D TMD layers for mechanically reconfigurable electronic devices