Sensitivity of interfacial bonding quality on strain rate in SA508-3/316L joints produced by vacuum hot-compression bonding

Maolong Zhang,Hao Lu,Chuanzong Li
DOI: https://doi.org/10.1016/j.vacuum.2024.113069
IF: 4
2024-02-01
Vacuum
Abstract:In this study, SA508-3/316L joints were fabricated using the vacuum hot-compression bonding technique, and the sensitivity of interfacial bonding quality to strain rate was revealed by microstructure characterization and mechanical testing. The results showed that a decarburized layer and a diffusion layer were formed in the interfacial region of the joint. Meanwhile, the interfacial diffusion layer thickness decreases with increasing strain rate and reaches its lowest value (3.4 μm) at a strain rate of 0.1 s−1, and subsequently increases to 4 μm at a strain rate of 1 s−1 due to adiabatic heat and interfacial pressure. Additionally, the accelerated dynamic recrystallization process in the interfacial region at high strain rates promotes interfacial grain boundary migration. The enhanced interfacial bonding quality ultimately leads to improved joint mechanical properties. The interfacial shear strength raised by 50 MPa as the strain rate increased from 0.1 s−1 to 1 s−1.
materials science, multidisciplinary,physics, applied
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