Zinc‐Imidazolate Films as an All‐Dry Resist Technology (Adv. Funct. Mater. 12/2024)

Peter Corkery,Kayley E. Waltz,Patrick M. Eckhert,Mueed Ahmad,Andrea Kraetz,Yurun Miao,Dennis T. Lee,Mohammed K. Abdel‐Rahman,Yucheng Lan,Paul Haghi‐Ashtiani,Aaron Stein,J. Anibal Boscoboinik,Michael Tsapatsis,D. Howard Fairbrother
DOI: https://doi.org/10.1002/adfm.202470069
IF: 19
2024-03-21
Advanced Functional Materials
Abstract:Zinc‐Imidazolate Films In article number 2311149, Michael Tsapatsis, D. Howard Fairbrother, and co‐workers report an all‐dry resist technology based on an amorphous zinc imidazolate metal‐organic framework deposited by atomic/molecular layer deposition and developed by low temperature gas phase etching, achieving resolution down to 22 nm. This methodology introduces a new direction for solvent‐free resist processing, enabling scalable, high‐resolution patterning techniques for advanced semiconductor fabrication.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
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