Stacking fault-induced strengthening mechanism in thermoelectric semiconductor Bi2Te3

Xiege Huang,Xiaobin Feng,Qi An,Ben Huang,Xiaolian Zhang,Zhongtao Lu,Guodong Li,Pengcheng Zhai,Bo Duan,G. Jeffrey Snyder,William A. Goddard,Qingjie Zhang
DOI: https://doi.org/10.1016/j.matt.2023.07.017
IF: 18.9
2023-08-10
Matter
Abstract:Huang et al. apply large-scale molecular dynamics simulations to discover that the formation of new stacking faults (SFs) can be introduced from slippage of Te-Te vdW layers during shearing of Bi2Te3. The different deformation mechanisms between high- and low-density SF models rely on the competition between SF formation energy and cleavage energy. The present work demonstrates an SF strategy to develop robust layered materials by improving the vdW interactions.
materials science, multidisciplinary
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