Abstract:Memory technologies and applications implemented fully or partially using emerging two‐dimensional (2D) materials have attracted increasing interest in the research community in recent years. Their unique characteristics provide new possibilities for highly integrated circuits with superior performances, low power consumption as well as special functionalities. Here, an overview of progress in 2D material‐based memory technologies and applications on the circuit level is presented. In the material growth and fabrication aspects, the advantages and disadvantages of various methods for producing large‐scale 2D memory devices in batches are discussed. Reports on 2D material‐based integrated memory circuits, from conventional dynamic random‐access memory (DRAM), static random‐access memory (SRAM), and Flash memory arrays, to emerging memristive crossbar structures, all the way to three‐dimensional (3D) monolithic stacking architecture, are systematically reviewed. Comparisons between experimental implementations and theoretical estimations for different integration architectures are given in terms of the critical parameters in 2D memory devices. Attempts to use 2D memory arrays for in‐memory computing applications, which are mostly focused on logic‐in‐memory and neuromorphic computing, are summarized here. Finally, we review the major challenges that impede the large‐scale applications of 2D material‐based memory, and also give perspectives on possible approaches towards a more reliable system‐level fabrication, hopefully shedding some light on future research in this field. This article is protected by copyright. All rights reserved

The development of integrated circuits based on two-dimensional materials

Two-dimensional devices and integration towards the silicon lines

The Road for 2D Semiconductors in the Silicon Age

The Roadmap of 2D Materials and Devices Toward Chips

From lab to fab: path forward for 2D material electronics

Two‐Dimensional Semiconductors: from Device Processing to Circuit Integration

Fabrication Technologies for the On‐Chip Integration of 2D Materials

Nanopatterning Technologies of Two‐Dimensional Materials for Integrated Electronic and Optoelectronic Devices

Transistors based on two-dimensional materials for future integrated circuits

Exploring Two-Dimensional Materials toward the Next-Generation Circuits: From Monomer Design to Assembly Control

Vertical Integration of 2D Building Blocks for All‐2D Electronics

Fabrication methods for integrating 2D materials

Two‐Dimensional Materials for Integrated Photonics: Recent Advances and Future Challenges

Two-Dimensional Semiconductors for State-of-the-Art Complementary Field-Effect Transistors and Integrated Circuits

Circuit Level Memory Technologies and Applications based on 2D Materials

Two-dimensional materials for future information technology: status and prospects

Advanced Hybrid 2D/CMOS Microchips Toward the Semiconductor Industry.

Electronics Based on Two-Dimensional Materials: Status and Outlook

Recent Progress in Devices and Circuits Based on Wafer-Scale Transition Metal Dichalcogenides.

Monolithic-3D Integration with 2D Materials: Toward Ultimate Vertically-Scaled 3D-ICs

Monolithic three-dimensional tier-by-tier integration via van der Waals lamination