Enhancing wear resistance, hardness, and thermal conductivity of copper diamond composites through optimization strategies

Nixon Poulose,P. Selvakumar
DOI: https://doi.org/10.1007/s12206-024-0321-8
IF: 1.81
2024-04-01
Journal of Mechanical Science and Technology
Abstract:This study investigates optimizing wear resistance, hardness, and thermal conductivity in copper diamond composites. Despite copper’s exceptional thermal and electrical properties, maintaining wear resistance at high temperatures remains a challenge. We address this by incorporating diamond particles into copper matrices using powder metallurgy. Through Taguchi and ANOVA analyses, we examine SEM microstructure, and mechanical properties, with a focus on wear performance. Employing the desirability function in Minitab 17 for optimization, we identify an optimal parameter set: 3 % volume diamond, 68.18 N applied load, and 7500 m sliding distance. The resulting wear loss of 24.736 m3, with a desirability rating exceeding 99.6 %, promises practical applications in wear-critical industries like aerospace and automotive.
engineering, mechanical
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