Abstract:The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.

Real-time study of the interplay between phase formation and stress evolution at the interface

Phase stability and the interface structure of a nanoscale Si crystallite in Al-based alloys

Growth kinetics and origin of residual stress of two-phase crystalline–amorphous nanostructured films

Study of Local Stress Using Stress-Absorbing Si Diaphragm

The structure, diffusion and phase formation in Mo/Si multilayers with stressed Mo layers

Thin-film electrodes for high-capacity lithium-ion batteries: influence of phase transformations on stress

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings

Substrate-Induced Stress In Silicon Nanocrystal/Sio2 Multilayer Structures

Size Effect on Raman Measured Stress and Strain Induced Phonon Shifts in Ultra-Thin Film Silicon

Investigation of the Strain–Stress Field in Nanoscale Multilayer Systems by the Phase Plane Method

Real-time Visualization of Convective Transportation of Solid Materials at Nanoscale.

Unraveling the Atomic-Scale Pathways Driving Pressure-Induced Phase Transitions in Silicon

Nano-size crystallites in Mo/Si multilayer optics

Origin of Plasticity in Nanostructured Silicon

Ultrafast laser interaction with transparent multi-layer SiO2/Si3N4 films

Stress-mediated Lithiation in Nanoscale Phase Transformation Electrodes

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Deformation, lattice instability, and metallization during solid-solid structural transformations under general applied stress tensor: example of Si I -> Si II

On the influence of interface charging dynamics and stressing conditions in strained silicon devices

A TEM study of Si-SiO2 interfaces in silicon nanodevices

Real-time Measurement of Stress and Damage Evolution During Initial Lithiation of Crystalline Silicon