Abstract:As thermosetting resins and composites made from them begin to be used in critical applications, it becomes necessary to monitor and analyze the cure of the resin within the confines of the processing equipment. Such measurements have been carried out using a dielectric technique called dielectrometry or dielectric analysis. Conventional dielectrometry has certain limitations associated with the use of parallel plate geometry for electrodes. For in situ measurement of cure, intrusiveness of electrodes is a problem which may require placement of electrodes in non‐strategic areas. Since electrode spacing changes during cure, it is difficult to deduce permittivity and loss factor from the data. At lower frequencies the capacitive currents are small and signal‐to‐noise ratios are small, therefore, measurement at low frequencies (>100 Hz) typically require large electrode sizes. One approach to overcome the problems described above is the development of microdielectrometry. A solid state integrated circuit chip, 2 by 4 mm in size, is used as the sensor. The miniature sensor can measure the properties of a dielectric on its surface, therefore it need not intrude into the composite part. Transistors which are built into the integrated circuit are used to amplify the signal to make low frequency (>1 Hz) measurements feasible. The electrode geometry does not change, therefore loss factor and permittivity data can be deduced in real‐time. During cure of the resin or composite material, permittivity and loss factor are measured continuously at a series of preselected frequencies. Real‐time‐data is plotted on a strip chart and is also stored in a cassette for later analysis. Temperature of the curing material is measured either by a diode on the sensor or by externally placed thermocouples. Results on an aromatic amine cured epoxy resin and a dicyandiamide cured epoxy resin prepreg are presented in this report. The data obtained by microdielectrometry is compared and correlated to results obtained using differential scanning calorimetry, infrared analysis, and dynamic mechanical analysis. Results show that microdielectrometry can be used to follow the cure of epoxy resins and absolute measurements of permittivity and loss factor can be made to provide information on the mechanisms that produce the observed changes. Data at 1 Hz can be obtained but for certain lossy systems at typical cure temperatures, the data is often out of range of the instrument, thus restricting use to 10 Hz and higher frequencies. At very high loss factors (>100) a “blocking” phenomenon is observed due to charge pile up at electrode surfaces which results in erroneously high permittivity values.

A mathematical model and microcontroller-based method for measuring dielectric permittivity and discharge characteristics with Arduino ATmega 328: a case study in a physics laboratory

Analysis of Conductor Loss in Interdigital Capacitor Based Measurement of Dielectric Constant of Ferroelectric Thin Film

Local Permittivity Measurement of Dielectric Materials Based on the Non-Contact Force Curve of Microwave Atomic Force Microscopy

Determination of Dielectric Constants through Capacitor Measurement Using Variations in Thickness, Area, Materials, and Density

Resistor and Capacitor Time Constant Measuring Instrument Using Arduino UNO

Computer Simulation of Partial Discharges in Voids inside Epoxy Resins Using Three-Capacitance and Analytical Models

Characterization of Electrochemical Double Layer Capacitor Electrode Using Self-Discharge Measurements and Modeling

Digital micro-capacitance measuring system and application

Analysis of Polymer-Ceramic Composites Performance on Electrical and Mechanical Properties through Finite Element and Empirical Models

The working principles and mathematical model of the capacitive sensor with electrodes of arbitrary shape

Nondestructive method of thin film dielectric constant measurements by two-wire capacitor

Development of a Sensor for Dielectric Constant Measurements Utilizing Time-Domain Measurement with a Vector Network Analyzer

Measurement based on twice cavity perturbations for permittivity of dielectric thin films

The use of microdielectrometry in monitoring the cure of resins and composites

Self-Healing in Dielectric Capacitors: a Universal Method to Computationally Rate Newly Introduced Energy Storage Designs

A Finite Element Analysis and an Improved Induced Charge Concept for Partial Discharge Modeling

A Broadband Sensor for Permittivity Measurement of Solid, Crystal Grain and Powder Dielectrics in Microwave Range

Method of measuring dielectric constant using an oscilloscope

Capacitance-voltage profiling of MOS capacitors: A case study of hands-on semiconductor testing for an undergraduate laboratory

Application and Significance of the Equivalent Circuit Method in the Analysis of Dielectric Response

High-Accuracy Complex Permittivity Characterization of Solid Materials Using Parallel Interdigital Capacitor- Based Planar Microwave Sensor