Abstract:As a special diffraction grating, the echelle grating has excellent beam splitting ability with the periodic groove pattern on it, which is characterized by low number of lines per millimeter and large flash angle. Al films with a layered structure determined by the coating technology are the first blanks for the echelle grating in mechanical scratching. However, the special interlayer structure of the layered Al films and the need for large depth and high precision triangular diffraction grooves have increased the difficulty of controlling the scratching process, and the traditional mechanical scratching "trial and error" process is still the main means. Therefore, in the study, molecular dynamics (MD) is utilized to simulate the mechanical response and deformation mechanism of polycrystalline layered Al films during the scratching process at different grain sizes and temperatures. The results represent that the friction force and normal force show a decreasing trend with increasing temperature, and the decrease in grain size leads to smaller friction and normal force; The number of removed atoms of polycrystalline layered Al films shows an increasing trend with increasing temperature, which improves the material removal rate and facilitates precise shape control of the groove; In addition, the presence of layered grain boundary interface hinders the downward propagation of defects such as dislocations and can accommodate dislocations. At the same time, the total length of dislocation lines decreases with increasing temperature, the high temperature promotes the transformation of crystals to an amorphous structure, and the grain boundaries between grains and the interlayer grain boundaries at the delamination limit the movement of dislocations. The deformation behavior indicates that grain boundaries play a key role in inhibiting the propagation of strain and stress, and a gradient distribution is formed at the layered grain boundary interface structure, which further hinders the downward transfer.

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Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon

Numerical and experimental investigation on ductile deformation and subsurface defects of monocrystalline silicon during nano-scratching

Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

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Coupled SPH-FEM modeling of Berkovich indenter scratching of single-crystal silicon

Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal

Reveal the Deformation Mechanism of (110) Silicon from Cryogenic Temperature to Elevated Temperature by Molecular Dynamics Simulation

Effects of grinding speeds on the subsurface damage of single crystal silicon based on molecular dynamics simulations

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Study on wear of diamond during scratching SiC using molecular dynamics simulations

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Molecular dynamics-based study of the effects of grain size and temperature on the nanoscratching groove characteristics of grating polycrystalline layered Al films

Effect of crystal orientation and temperature on the mechanical properties and fracture mechanism of silicon carbide nanowires