Abstract:The ability to weld metals and sapphire is widely required in aerospace, micro-electro-mechanical systems and microwave energy delivery devices. The experiments of femtosecond laser welding between sapphire and copper (Cu) were conducted under non-optical contact conditions. And the effect of pre-fabricating a Ti film on the sapphire surface using femtosecond laser on the bonding strength of ssapphire/Cu joint was investigated. The interface of the sapphire/Cu directly welded by femtosecond laser contains a mixture of sapphire and copper, and the shear strength of the sapphire/Cu interface was approximately 46.4 MPa. The results indicated that the laserinduced molten state of sapphire and the laser-ablated copper mixed together at the interface, filling the gaps and forming an effective metallurgical bond. And then, in the case that the Ti film was prepared on the sapphire surface through femtosecond laser-induced backward transfer (LIBT), a Ti transition layer between sapphire and cooper was observed on the bonding interface of the joint, and the shear strength of the joint increased to approximately 115.5 MPa. A mixture of sapphire, copper, titanium, and titanium oxide was observed at the interface of the joint. The Ti layer between sapphire and copper may effectively alleviated residual stresses at the interface and promoted bonding between copper and sapphire, thereby improving the strength of the joint. The methods and results of this study have reference value for the ultrafast laser bonding between other transparent brittle materials and metals.

Research advances in joining processes of sapphire

Heterogeneous material joining of sapphire and TC4 alloy with a functionally graded interface

Study on interface behavior of Be/CuCrZr alloy by diffusion bonding

Microstructure and Characterization of Interfacial Phases of Sapphire/sapphire Joint Bonded Using Bi2O3–B2O3–ZnO Glass

Bonding Layer Microstructures and Mechanical Behavior of Sapphire/Sapphire Joints Diffusion-Bonded Using Mgo-Al2o3-Sio2 Interlayer

Bonding and Strengthening Mechanism on Ultrasonic-Assisted Soldering of Sapphire Using Sn-3.5Ag-4Al Solder

Microstructure and Mechanical Performance of Composite Joints of Sapphire by Ultrasonic-Assisted Brazing

Crystallization Behaviour of 25bi2o3–75b2o3 Glass Braze and Strengthening Mechanism of Crystallization-Reinforced Sapphire/25bi2o3–75b2o3/sapphire Joints

Microstructural Evolution, Mechanical Properties, and FEM Analysis of the Residual Stress of Sapphire Joints Brazed with a Novel Borate Glass

Research Progress in Strengthening Sapphire

Evolution of Interfacial Structures and Mechanical Performance of Sapphire and Sn–9Zn–2Al Joints by Ultrasound

Femtosecond Laser Welding of Sapphire-Copper Using a Thin Film Titanium Interlayer

Ultrasonic-assisted brazing of sapphire with high strength Al–4.5Cu–1.5Mg alloy

Microstructure and Mechanical Property of Titanium Film-Modified Sapphire/High Nb-TiAl Alloy Joints Using Ag-Cu Filler by Vacuum Brazing

Metallization on Sapphire and Low-Temperature Joining with Metal Substrates

Interfacial Microstructure and Mechanical Properties of Titanium/Sapphire Joints Brazed with AuSn20 Filler Metal

Bonding Sapphire in Air by Using Bi2O3–B2O3 Glass Braze

Microstructure and Mechanical Property of Sapphire Joints Reinforced Byal4b2o9 Whiskers

New Design of Sapphire Joints Brazed with Bismuth-Borate Glass

Joining SiO 2 Based Ceramics: Recent Progress and Perspectives

Joining SiO2 based ceramics: recent progress and perspectives