Abstract:The present study endeavors to investigate the thermal dissipation capability of a chip-on-board package by means of a comprehensive experimental and numerical analysis. For this purpose, a BiCMOS chip is designed and fabricated in conjunction with three different printed circuit board (PCB) configurations, including a single-sided board, a thermal via board, and a copper frame board. Transient thermal measurements are carried out on all three packages, and the results are subsequently transformed into cumulative structure functions. Then the finite element models are established for each package configuration, and their validity is confirmed through comparison with the experimental structure functions. The models are then characterized in accordance with the Joint Electron Device Engineering Council (JEDEC) 38-set boundary conditions, followed by a series of optimizations targeted toward the PCB, including the board stack-up and the board sizes. Parametric studies are performed to quantitatively assess the impact of these parameters on the thermal performance. Finally, the present study provides a comprehensive discussion of the optimal application scenarios for each board configuration, with a view to achieving good thermal performance. The findings of this study will contribute to the development of more thermally effective chip-on-board packages for high-performance electronic systems.

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Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

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High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods

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Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

Extraction of the Complex Permittivity of PCB

Efficient Analysis of Radiated Immunity of Printed Circuit Boards Using SPICE

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Analysis of insulated-metal-substrates structures in the context of heat dissipation enhancement

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Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

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Temperature Field Analysis and Parametric Study of the Package-on-Package

Study on Self-Heat Effects in Integrated Circuits with Hot-Spot and Electro-Thermal Coupling Methods