Computing With COOL Chips

Hsien-Hsin S. Lee

DOI: https://doi.org/10.1109/mm.2024.3354368

IF: 2.8212

2024-01-01

IEEE Micro

Abstract:In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.

computer science, software engineering, hardware & architecture

What problem does this paper attempt to address?

Special Issue on COOL Chips

Ryusuke Egawa,Yasutaka Wada

DOI: https://doi.org/10.1109/mm.2024.3353949

IF: 2.8212

2024-02-16

IEEE Micro

Abstract:This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.

computer science, software engineering, hardware & architecture
Special Issue on Hot Chips 2023

Heiner Litz,Natalia Vassilieva

DOI: https://doi.org/10.1109/mm.2024.3396008

IF: 2.8212

2024-06-25

IEEE Micro

Abstract:This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.

computer science, software engineering, hardware & architecture
ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Hussam Amrouch,Di Gao,Xiaobo Sharon Hu,Arman Kazemi,Ann Franchesca Laguna,Kai Ni,Michael T. Niemier,Mohammad Mehdi Sharifi,Simon Thomann,Xunzhao Yin,Cheng Zhuo

DOI: https://doi.org/10.1109/ICCAD51958.2021.9643578

2021-01-01

Abstract:The rapidly increasing volume and complexity of data is demanding the relentless scaling of computing power. With transistor feature size approaching physical limits, the benefits that CMOS technology can provide is diminishing. For future energy efficient computing systems, researchers aim to exploit various emerging nanotechnologies to replace conventional CMOS technology. In particular, ferroelectric FETs (FeFETs) appear to be a promising candidate to continue improving energy efficiency for data-intensive applications. Advances in FeFET scalability and FeFET compatibility with CMOS have sparked growing interest in device, circuit, and system communities. While FeFET is still evolving, many researchers and developers are already cautiously optimistic about its future. This paper provides a review on FeFET's recent technology advances, challenges, and opportunities, with a particular emphasis upon device modeling and circuit design of FeFET content addressable memory, as well as their applications in machine learning.
Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Tahir Hussain,Dana C. Wheeler,Hasan Sharifi,Keisuke Shinohara,Zhiwei Xu,James C. Li,Pamela R. Patterson,Kenneth R. Elliott,Wonill Ha,Yakov Royter,Peter D. Brewer

DOI: https://doi.org/10.1109/sirf.2014.6828535

2014-01-01

Abstract:HRL Laboratories is part of an intense research and development effort to leverage the enormously advanced infrastructure of Si CMOS and the high performance of diverse electronic and photonic devices in an integrated technology. While System in a Package (SiP) and System on a Chip (SoC) approaches involve chips produced in their native foundries and subsequent integration using hybridization or multi-chip modules, HRL has pioneered approaches where partially completed wafers of diverse technologies are integrated using highly intimate placement and heterogeneous interconnects to enable transistor-level integration. Novel ICs have been produced in InP BiCMOS and CMOS memristor-integrated technologies. Unprecedented design flexibility is being enabled with intimate integration of GaN HEMTs together with InP and CMOS.
Computing-in-memory Circuits and Cross-Layer Integrated Design and Optimization: from SRAM to FeFET

Xunzhao YIN,Jinshan YUE,Qingrong HUANG,Chao LI,Jiahao CAI,Zeyu YANG,Cheng ZHUO,Ming LIU

DOI: https://doi.org/10.1360/ssi-2021-0420

2022-01-01

Scientia Sinica Informationis

Abstract:In the era of artificial intelligence (AI) and the Internet of Things (IoT), the emerging data-driven applications and tasks have significantly promoted the development of national digitization. However, due to the separation of storage and computing in traditional von Neumann hardware, the resulted memory wall issue leads to heavy data transfer costs in data-intensive applications, which inhibits the improvements of energy efficiency and performance.As a novel computing paradigm deviating from the traditional architecture in the post-Moore era, the computing-in-memory (CiM) technique integrates computing logic into storage by leveraging the characteristics of memory devices and circuits to eliminate the data transfer overhead. Such a promising approach can significantly improve the energy efficiency and performance of intelligent hardware platforms. Based on the traditional CMOS and the emerging non-volatile memory device ferroelectric FET, this review summarizes the key CiM circuit designs, and discusses the integrated design and optimization approaches across the device, architecture, chip, algorithm, and application layers.
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits—Volume 5, No. 1

Azad Naeemi

DOI: https://doi.org/10.1109/jxcdc.2019.2920744

2019-06-01

Abstract:Welcome to the fifth volume, first semiannual issue of the Journal on Exploratory Solid-State Computational Devices and Circuits (JXCDC), a multidisciplinary, open access IEEE journal that is focused on publishing seminal research in the exploration for energy-efficient computing based on physics and materials to enable new devices, circuits, and architecture that will be of great interest to integrated circuit researchers and those working in the IT industry. The papers in the journal are selectively chosen to provide insight into the architectural, circuit, and device implications of emerging quantum nanoelectronic and nanomagnetic device technologies. The discovery of new materials, devices, and circuits for energy-efficient computational circuits will be needed to enable Moore’s law to continue for computing beyond the end of the roadmap for CMOS technologies by enabling a significant improvement in energy efficiency and cost per function.
Special Issue On Computation, Business, And Health Science

Doug Vogel,Honggeng Zhou,Daning Hu

DOI: https://doi.org/10.1016/j.bdr.2015.03.002

IF: 3.3

2015-01-01

Big Data Research

Abstract:No abstract available.
Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices

Zhiming Chen

DOI: https://doi.org/10.3390/mi15030327

IF: 3.4

2024-02-28

Micromachines

Abstract:Complementary Metal Oxide Semiconductor (CMOS) and Micro-Electro-Mechanical System (MEMS) devices play significant roles in emerging research fields such as artificial intelligence (AI) [...]

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Low-temperature CMOS Technology for High-Performance Computing: Development and Challenges

Ran CHENG,Bo LI,Zongwei WANG,Jieyin ZHANG,Weiwei SHAN,Jianjun ZHANG,Yimao CAI,Genquan HAN

DOI: https://doi.org/10.1360/ssi-2023-0347

2024-01-01

Scientia Sinica Informationis

Abstract:Over the past 60 years,the progress of integrated circuit technology has promoted the prosperity of the information industry.As process technology pioneers sub-10 nm nodes,further performance improvement through device miniaturization encounters great challenges from both the cost and technology perspectives.It is a must to explore novel device structures,circuit design,or architecture to achieve higher computing performance.Low-temperature(LT,77 K)complementary metal oxide semiconductor(CMOS)technology,which benefits from higher device performance at lower temperatures,can be used to further increase computing speed and reduce dynamic and static power consumption.Due to the high level of compatibility with current CMOS technology,it is an ideal choice for future high-performance computing at an acceptable cost.Another scenario for the application of cryogenic or ultralow-temperature(＜10 K)CMOS circuits is integration with qubits to realize large-scale quantum chips.This paper reviews the history and state-of-the-art progress in low-temperature CMOS technology,including device characterization,modeling,process design kits,applications,etc.Theoretical and technical challenges in the field are forecast and discussed.Possible solutions are also provided to guide the continuous development of low-temperature CMOS technology in China.
Trending IC Design Directions in 2022

Chi-Hang Chan,Lin Cheng,Wei Deng,Peng Feng,Li Geng,Mo Huang,Haikun Jia,Lu Jie,Ka-Meng Lei,Xihao Liu,Xun Liu,Yongpan Liu,Yan Lu,Kaiming Nie,Dongfang Pan,Nan Qi,Sai-Weng Sin,Nan Sun,Wenyu Sun,Jiangtao Xu,Jinshan Yue,Milin Zhang,Zhao Zhang

DOI: https://doi.org/10.1088/1674-4926/43/7/071401

2022-01-01

Journal of Semiconductors

Abstract:For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.
Top Picks Ignite Innovation

Hsien-Hsin S. Lee

DOI: https://doi.org/10.1109/mm.2024.3433189

IF: 2.8212

2024-08-29

IEEE Micro

Abstract:This IEEE Micro Special Issue on Top Picks includes 12 outstanding papers selected from those published in 2023 computer architecture conferences. When we were prepping and putting together all the articles in this special issue, another significant event in the computer industry was unfolding in Taipei, Taiwan, in June: the 2024 COMPUTEX Taipei. The event hosted more than 1500 exhibitors from 136 countries and regions, showcasing the latest innovations and sleek products in information and computing technologies. Unparalleled to previous equivalent events, the 2024 COMPUTEX organizers invited an elite group of influential leaders from today's technology juggernauts to deliver keynotes. The program features AMD CEO Lisa Su, Delta Electronics General Director Tzi-cker Chiueh, Intel CEO Pat Gelsinger, MediaTek CEO Rick Tsai, NXP CTO Lars Reger, Qualcomm CEO Cristiano Amon, and Supermicro CEO Charles Liang. They were joined by a couple of additional speakers, ARM CEO Rene Haas and Nvidia CEO Jensen Huang, who delivered their keynotes outside the COMPUTEX exhibition hall. These Top Picks speakers represent the ecosystem companies of the computing infrastructure supply chain that help shape, bolster, and accelerate the Fourth Industrial Revolution, driven by the prevailing and unstoppable artificial intelligence (AI) tsunami. The unveiled systems push the frontiers of technology, reaching the pinnacle of computer architecture design, system integration, advanced packaging techniques, and leading-edge process technologies.

computer science, software engineering, hardware & architecture
Microelectronics Journal: Preface

Shuittong Lee,ChangChun Zhu,Ningsheng Xu

DOI: https://doi.org/10.1016/S0026-2692(03)00236-2

IF: 1.992

2004-01-01

Microelectronics Journal

Abstract:null
An Incoming World of Decoupling Siliconomy

Hsien-Hsin S. Lee

DOI: https://doi.org/10.1109/mm.2024.3394671

IF: 2.8212

2024-06-25

IEEE Micro

Abstract:This issue presents top works selected from 2023 Hot Chips symposium (HotChips 2023.) Beyond their influence to our daily lives, semiconductor chips have also emerged as a critical asset in nation-to-nation geopolitics.

computer science, software engineering, hardware & architecture
Challenges and Opportunities in Computing Research to Enable Next Generation Engineering Applications

Janet K. Allen,Ehsan T Esfahani,Satyandra K. Gupta,Balan Gurumoorthy,Bin He,Ying Liu,John Michopoulos,Jitesh H. Panchal,Anurag Purwar,Kristina Wärmefjord

DOI: https://doi.org/10.1115/1.4063437

IF: 2.3

2023-09-14

Journal of Computing and Information Science in Engineering

Abstract:Abstract Recent advances in computing and information science such as artificial intelligence (AI), machine learning (ML), edge computing, cloud computing, metacomputing, and quantum computing are creating new computing paradigms. These advances are providing new opportunities for new research and application development. For instance, the adoption of Industry 4.0 enabled by AI/ML is fundamentally changing how products are designed, manufactured, maintained, and recycled. It enables consideration of all aspects of the product life cycle and realizing sustainable designs and helps us in achieving carbon neutrality. Intelligent machines such as robots and autonomous vehicles are revolutionizing human-machine interactions and increasing digitalization in the manufacturing and transportation industries. It is important for the Journal of Computing and Information Science in Engineering (JCISE) community to identify challenges and opportunities in these emerging areas and inspire new researchers to join the field and become a part of the community. This Special Issue consists of 19 position papers that span a wide variety of topics of interest to the JCISE community. These position papers identify challenges and opportunities, outline new areas of research, and point out new applications that will be enabled by advances in this field.

engineering, manufacturing,computer science, interdisciplinary applications
Introduction Of Special Issue on FPGA-Based Computing [From The Guest Editors]

Zhiru Zhang,Hongbo Rong,Yu Wang

DOI: https://doi.org/10.1109/MCAS.2021.3071606

IF: 4.04

2021-01-01

IEEE Circuits and Systems Magazine

Abstract:The articles in this special section focus on field-programmable gate arrays (FPGAs)- based computing. Over the past three decades, FPGAs have evolved from small chips with a few thousand logic blocks to billion- transistor system-on-chips. Modern FPGAs provide massive fine-grained parallelism, high energy efficiency, and more predictable performance than CPUs and GPUs. More importantly, they can ...
Nanomechanics: Emerging Opportunities for Future Computing

Wang Zenghui,Fang Jiawei,Zhang Pengcheng,Yang Rui

DOI: https://doi.org/10.1007/s11432-020-3241-9

2021-01-01

Science China Information Sciences

Abstract:The exploration for greater computing power has existed for a long time.Since the 1960s,transistors in modern elec-tronic computers have kept advancing following Moore's law.However,as silicon transistors continue to scale down,they face challenges such as increases in OFF-state leakage power due to the limited subthreshold swing,incompatibility with high-temperature operation,and lack of reconfigurability.Therefore,new types of computing devices are being ex-plored to address these problems.
Editorial for the Special Issue on the Latest Advancements in Semiconductor Materials, Devices and Systems

Xinghuan Chen,Fangzhou Wang,Zirui Wang,Zeheng Wang,Jing-Kai Huang

DOI: https://doi.org/10.3390/mi15121422

IF: 3.4

2024-11-28

Micromachines

Abstract:The field of semiconductor research is experiencing a paradigm shift as the boundaries of Moore's Law are being approached [...]

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]

Yang Hu,Xinhan Lin,Huizheng Wang,Zhen He,Xingmao Yu,Jiahao Zhang,Qize Yang,Zheng Xu,Sihan Guan,Jiahao Fang,Haoran Shang,Xinru Tang,Xu Dai,Shaojun Wei,Shouyi Yin

DOI: https://doi.org/10.1109/mcas.2024.3349669

IF: 4.04

2024-01-01

IEEE Circuits and Systems Magazine

Abstract:Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing demand for AI continues to grow, the growth of hardware computing power has failed to keep up. This has become a significant factor restricting the development of AI. The augmentation of hardware computing power is mainly propelled by the escalation of transistor density and chip area. However, the former is impeded by the termination of the Moore's Law and Dennard scaling, and the latter is significantly restricted by the challenge of disrupting the legacy fabrication equipment and process. In recent years, advanced packaging technologies that have gradually matured are increasingly used to implement bigger chips that integrate multiple chiplets, while still providing interconnections with chip-level density and bandwidth. This technique points out a new path of continuing the increase of computing power while leveraging the current fabrication process without significant disruption. Enabled by this technique, a chip can extend to a size of wafer-scale provisioning orders of magnitude more computing capabilities (several POPS within just one monolithic chip) and die-to-die bandwidth density (over 15 GB/s/mm) than regular chips, and emerges a new Wafer-scale Computing paradigm. Compared to conventional high-performance computing paradigms such as multi-accelerator and datacenter-scale computing, Wafer-scale Computing shows remarkable advantages in communication bandwidth, integration density, and programmability potential. Not surprisingly, disruptive Wafer-scale Computing also brings unprecedented design challenges for hardware architecture, design- $\backslash $ system- technology co-optimization, power and cooling systems, and compiler tool chain. At present, there are no comprehensive surveys summarizing the current state and design insights of Wafer-scale Computing. This article aims to take the first step to help academia and industry review existing wafer-scale chips and essential technologies in a one-stop manner. So that people can conveniently grasp the basic knowledge and key points, understand the achievements and shortcomings of existing research, and contribute to this promising research direction.
Wafer-scale Computing: Advancements, Challenges, and Future Perspectives

Yang Hu,Xinhan Lin,Huizheng Wang,Zhen He,Xingmao Yu,Jiahao Zhang,Qize Yang,Zheng Xu,Sihan Guan,Jiahao Fang,Haoran Shang,Xinru Tang,Xu Dai,Shaojun Wei,Shouyi Yin

2023-10-14

Abstract:Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing demand for AI continues to grow, the growth of hardware computing power has failed to keep up. This has become a significant factor restricting the development of AI. The augmentation of hardware computing power is mainly propelled by the escalation of transistor density and chip area. However, the former is impeded by the termination of the Moore's Law and Dennard scaling, and the latter is significantly restricted by the challenge of disrupting the legacy fabrication equipment and process. In recent years, advanced packaging technologies that have gradually matured are increasingly used to implement bigger chips that integrate multiple chiplets, while still providing interconnections with chip-level density and bandwidth. Compared to conventional high-performance computing paradigms such as multi-accelerator and datacenter-scale computing, Wafer-scale Computing shows remarkable advantages in communication bandwidth, integration density, and programmability potential. Not surprisingly, disruptive Wafer-scale Computing also brings unprecedented design challenges for hardware architecture, design-system-technology co-optimization, power and cooling systems, and compiler tool chain. At present, there are no comprehensive surveys summarizing the current state and design insights of Wafer-scale Computing. This paper aims to take the first step to help academia and industry review existing wafer-scale chips and essential technologies in a one-stop manner. So that people can conveniently grasp the basic knowledge and key points, understand the achievements and shortcomings of existing research, and contribute to this promising research direction.

Hardware Architecture
Recent Progress of Integrated Circuits and Optoelectronic Chips

Hao Yue,Xiang Shuiying,Han Genquan,Zhang Jincheng,Ma Xiaohua,Zhu Zhangming,Guo Xingxing,Zhang Yahui,Han Yanan,Song Ziwei,Liu Yan,Yang Ling,Zhou Hong,Shi Jiangyi,Zhang Wei,Xu Min,Zhao Weisheng,Pan Biao,Huang Yangqi,Liu Qi,Cai Yimao,Zhu Jian,Ou Xin,You Tiangui,Wu Huaqiang,Gao Bin,Zhang Zhiyong,Origin Quantum Computing Company Limited,Chen Yonghua,Liu Yong,Chen Xiangfei,University of Chinese Academy of Sciences,Wang Xingjun,Zhao Lixia,Zou Xihua,Yan Lianshan

DOI: https://doi.org/10.1007/s11432-021-3235-7

2021-01-01

Science China Information Sciences

Abstract:Integrated circuits(ICs) and optoelectronic chips are the foundation stones of the modern information society. The IC industry has been driven by the so-called "Moore’s law" in the past 60 years, and now has entered the post Moore’s law era. In this paper, we review the recent progress of ICs and optoelectronic chips. The research status, technical challenges and development trend of devices, chips and integrated technologies of typical IC and optoelectronic chips are focused on. The main contents include the development law of IC and optoelectronic chip technology, the IC design and processing technology, emerging memory and chip architecture, brain-like chip structure and its mechanism, heterogeneous integration, quantum chip technology, silicon photonics chip technology, integrated microwave photonic chip, and optoelectronic hybrid integrated chip.

Computing With COOL Chips

Special Issue on COOL Chips

Special Issue on Hot Chips 2023

ICCAD Tutorial Session Paper Ferroelectric FET Technology and Applications: From Devices to Systems

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Computing-in-memory Circuits and Cross-Layer Integrated Design and Optimization: from SRAM to FeFET

IEEE Journal on Exploratory Solid-State Computational Devices and Circuits—Volume 5, No. 1

Special Issue On Computation, Business, And Health Science

Editorial for the Special Issue on State-of-the-Art CMOS and MEMS Devices

Low-temperature CMOS Technology for High-Performance Computing: Development and Challenges

Trending IC Design Directions in 2022

Top Picks Ignite Innovation

Microelectronics Journal: Preface

An Incoming World of Decoupling Siliconomy

Challenges and Opportunities in Computing Research to Enable Next Generation Engineering Applications

Introduction Of Special Issue on FPGA-Based Computing [From The Guest Editors]

Nanomechanics: Emerging Opportunities for Future Computing

Editorial for the Special Issue on the Latest Advancements in Semiconductor Materials, Devices and Systems

Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]

Wafer-scale Computing: Advancements, Challenges, and Future Perspectives

Recent Progress of Integrated Circuits and Optoelectronic Chips