An Incoming World of Decoupling Siliconomy

Hsien-Hsin S. Lee

DOI: https://doi.org/10.1109/mm.2024.3394671

IF: 2.8212

2024-06-25

IEEE Micro

Abstract:This issue presents top works selected from 2023 Hot Chips symposium (HotChips 2023.) Beyond their influence to our daily lives, semiconductor chips have also emerged as a critical asset in nation-to-nation geopolitics.

computer science, software engineering, hardware & architecture

What problem does this paper attempt to address?

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Tahir Hussain,Dana C. Wheeler,Hasan Sharifi,Keisuke Shinohara,Zhiwei Xu,James C. Li,Pamela R. Patterson,Kenneth R. Elliott,Wonill Ha,Yakov Royter,Peter D. Brewer

DOI: https://doi.org/10.1109/sirf.2014.6828535

2014-01-01

Abstract:HRL Laboratories is part of an intense research and development effort to leverage the enormously advanced infrastructure of Si CMOS and the high performance of diverse electronic and photonic devices in an integrated technology. While System in a Package (SiP) and System on a Chip (SoC) approaches involve chips produced in their native foundries and subsequent integration using hybridization or multi-chip modules, HRL has pioneered approaches where partially completed wafers of diverse technologies are integrated using highly intimate placement and heterogeneous interconnects to enable transistor-level integration. Novel ICs have been produced in InP BiCMOS and CMOS memristor-integrated technologies. Unprecedented design flexibility is being enabled with intimate integration of GaN HEMTs together with InP and CMOS.
Special Issue on Hot Chips 2023

Heiner Litz,Natalia Vassilieva

DOI: https://doi.org/10.1109/mm.2024.3396008

IF: 2.8212

2024-06-25

IEEE Micro

Abstract:This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.

computer science, software engineering, hardware & architecture
Semiconductor production, geopolitics and the CHIP SACT of 2022: a theoretical analysis

Katherine Hyatt,Patrick M. Ryle,Mark A. McKnight

DOI: https://doi.org/10.1108/dprg-12-2023-0184

2024-06-28

Digital Policy Regulation and Governance

Abstract:Purpose This paper aims to examine rising geopolitical tensions associated with the implementation of the US Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2022. Design/methodology/approach To provide background for the analysis, the authors conduct a theoretic analysis of the literature to introduce the current geopolitical environment while examining the rising threat of conflict, general factors driving change in the world order, and the critical role that the international semiconductor supply chain plays to all involved. Findings In this paper, the authors observe that in good times, economic forces drive capital-intensive industries toward a free-trade-inspired concentration of manufacturing in low-cost centers of production. In challenging economic and geopolitical times, however, the trend reverses toward retrenchment and what some call techno-nationalism. This occurs as nations struggle to secure access to critical sources of supply for themselves while stifling access for competitors and rivals. Practical implications The CHIPS Act of 2022 signifies a pivotal change in global trade dynamics, shifting away from liberal norms to techno-nationalism. This shift may spark supply chain hurdles as countries adopt nationalistic sourcing, potentially causing shortages in vital components like chips. Consequently, consumers may face disruptions as companies seek alternative suppliers, resulting in higher costs and lower-quality products. Supply chain disruptions may also delay product launches, and retaliatory trade actions could affect multiple industries, limiting access to lucrative markets. Originality/value The passage of the US CHIPS Act of 2022 has major implications related to global supply chain issues and potential geopolitical concerns. This study uses the threat of potential conflict as a lens for examining the international semiconductor supply chain.
Can de-risking avert supply chain precarity in the face of China-U.S. geopolitical tensions? From sanctions to semiconductor resilience and national security

Qingxiu Bu

DOI: https://doi.org/10.1365/s43439-024-00125-1

2024-06-25

International Cybersecurity Law Review

Abstract:Abstract As a main driver of geoeconomic power, technological supremacy is at stake in the current zero-sum tech war between the U.S. and China. Semiconductor chips have become an emerging geopolitical frontier in the rivalry of the two powers. Since the confrontation has intensified, the U.S. seeks to weaponise its dominant position in the global semiconductor value chain (GSVC). Some industrial policy-driven geostrategic approaches inform the race to reduce the GSVC vulnerabilities. The tit for tat nature of sanctions risks making multilateralism decline and further undermining the effectiveness of the global governance regime. Shifts in rising economic competition highlight the constraints on collective action. It remains critical as to whether the international economic and legal system can survive the current fractured geopolitics, and whether the new thinking on global governance could be viable for a non-zero-sum game.
The Road for 2D Semiconductors in the Silicon Age (adv. Mater. 48/2022)

Shuiyuan Wang,Xiaoxian Liu,Peng Zhou

DOI: https://doi.org/10.1002/adma.202270332

IF: 29.4

2022-01-01

Advanced Materials

Abstract:Advanced MaterialsVolume 34, Issue 48 2270332 FrontispieceFree Access The Road for 2D Semiconductors in the Silicon Age (Adv. Mater. 48/2022) Shuiyuan Wang, Shuiyuan Wang ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this authorXiaoxian Liu, Xiaoxian Liu ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this authorPeng Zhou, Peng Zhou ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 China Frontier Institute of Chip and System, Shanghai Frontier Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this author Shuiyuan Wang, Shuiyuan Wang ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this authorXiaoxian Liu, Xiaoxian Liu ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this authorPeng Zhou, Peng Zhou ASIC & System State Key Lab, School of Microelectronics, Fudan University, Shanghai, 200433 China Frontier Institute of Chip and System, Shanghai Frontier Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai, 200433 ChinaSearch for more papers by this author First published: 01 December 2022 https://doi.org/10.1002/adma.202270332AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Graphical Abstract 2D Semiconductors In article number 2106886, Peng Zhou and co-workers review and discuss the two main development paths for 2D semiconductors in the silicon age: mitigating the challenges of silicon-based devices and creating technologies that go beyond the von Neumann architecture; claiming that achieving heterogeneous integration of 2D semiconductors with silicon is the most promising option. Volume34, Issue48Special Issue: 2D CircuitsDecember 1, 20222270332 RelatedInformation
The future of two-dimensional semiconductors beyond Moore's law

Ki Seok Kim,Junyoung Kwon,Huije Ryu,Changhyun Kim,Hyunseok Kim,Eun-Kyu Lee,Doyoon Lee,Seunghwan Seo,Ne Myo Han,Jun Min Suh,Jekyung Kim,Min-Kyu Song,Sangho Lee,Minsu Seol,Jeehwan Kim

DOI: https://doi.org/10.1038/s41565-024-01695-1

Abstract:The primary challenge facing silicon-based electronics, crucial for modern technological progress, is difficulty in dimensional scaling. This stems from a severe deterioration of transistor performance due to carrier scattering when silicon thickness is reduced below a few nanometres. Atomically thin two-dimensional (2D) semiconductors still maintain their electrical characteristics even at sub-nanometre scales and offer the potential for monolithic three-dimensional (3D) integration. Here we explore a strategic shift aimed at addressing the scaling bottleneck of silicon by adopting 2D semiconductors as new channel materials. Examining both academic and industrial viewpoints, we delve into the latest trends in channel materials, the integration of metal contacts and gate dielectrics, and offer insights into the emerging landscape of industrializing 2D semiconductor-based transistors for monolithic 3D integration.
Recent U.S. Government and foreign national government and commercial literature on semiconductors

Bert Chapman,Bert ChapmanGovernment Information & Political Science Librarian,Purdue University Libraries,West Lafayette,IN,USA

DOI: https://doi.org/10.1080/08963568.2024.2317517

2024-02-26

Journal of Business & Finance Librarianship

Abstract:Semiconductors play a major role in U.S. and international economic activity and in national security policymaking. They are tiny electronic devices based primarily on silicon or germanium, facilitating multiple industrial activities including systems foundational to U.S. technological competitiveness and national security. This industry is a key U.S. exporter with this product's design and manufacturing being a global enterprise with design, fabrication, assembly, testing, and packing distributed globally. Semiconductors are essential building blocks for emerging technologies including artificial intelligence, autonomous systems, 5 G communications, and quantum computing. This article aspires to inform librarians and others about governmental and commercial literature produced on this subject. It aspires to enhance understanding of this topic and its intersections with economics, consumer goods, technology politics, and international security. (Platzer, Sutter, & Sargeant, Citation 2020 ; Summary, 1–3).
Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security

Gang Qu

DOI: https://doi.org/10.1109/mdat.2023.3349082

2024-02-23

IEEE Design and Test

Abstract:The globalization of IC design is forcing IC and IP core designers and users to reconsider the security and trust of hardware as the semiconductor industry is losing multiple billions of dollars annually due to IP infringement. An attacker can reverse engineer the functionality of an IC/IP, steal and claim ownership of the IP, inject malicious circuitry into the IC, introduce counterfeits into the supply chain, or overbuild ICs/IPs and sell them illegally.

engineering, electrical & electronic,computer science, hardware & architecture
The Economy–Security Nexus: Risk, Strategic Autonomy and the Regulation of the Semiconductor Supply Chain

Benjamin Farrand

DOI: https://doi.org/10.1017/err.2024.63

2024-10-15

European Journal of Risk Regulation

Abstract:The EU's policies in the field of technology broadly defined are increasingly marked by a concern over strategic autonomy, and Europe's place in the world. Regulatory interventions are framed in terms of "digital sovereignty," with the Commission seeking to ensure that external dependencies are reduced with the aim of increasing the EU's resilience to geopolitical instability and external shocks. Using the case study of semiconductors, the chips that power modern electronic devices, this article explores how technology policy in the EU sits at the economy–security nexus, in which economic goals and security goals are interdependent and inseparable. Focusing on the life cycle of the semiconductor supply chain from the control over natural resources through to the cybersecurity requirements placed on the finished products, this article demonstrates the increasing security logic embedded within a burgeoning industrial technology policy.
China’s Counter-Strategy to American Export Controls in Integrated Circuits

Douglas B. Fuller

DOI: https://doi.org/10.2139/SSRN.3798291

2021-03-01

Abstract:This article examines China’s efforts to counter American sanctions against Huawei that in effect try to weaponize the silicon supply chain. While China has taken tentative steps to try to decouple from the American semiconductor industry, it faces three continuing challenges. First, the areas of technological dependence that the Huawei Entity List sanctions highlighted, fabrication capital equipment and electronic design automation (EDA) software, are areas in which China has very weak capabilities. Second, the wider the scope of the sanctions is, the more likely local and foreign firms will be willing to cooperate with Chinese efforts to create substitutes for controlled American technologies. But the scope of the sanctions appears to be in stasis and may even narrow during the Biden administration. Finally, the progressive expansion of China’s silicon ambitions has elicited foreign industrial policies to counter China’s own policies. This expanding market outside of China will lessen the effectiveness of Chinese policy and at the same time make a certain level of controls over IC technology palatable to American partners as Chinese customers are replaced by others.

Engineering,Political Science,Business,Economics
Exploring the Global Trends in Semiconductor Supply Chain Development from the Perspective of US-China Relations

Lingyi Tang

Abstract:. In the global news, there is malicious speculation regarding the strategic harm of other countries in the China-US trade war. However, this article takes an analysis from the perspective of the chip industry to examine the hazards, opportunities, and development trends of the global supply chain within the context of intense geopolitical factors. It discusses the convenient speculation and fragile contradictions in the current state of globalization, considering economic theory, government policies, game theory, and other aspects. Through such an analysis, it aims to provide a clearer understanding of the intricate relationships within the supply chain, while reminding individuals to analyze the underlying fears and make more rational predictions about international conflicts

Political Science,Economics,Engineering,Business
How Techno-Nationalism Affects Technological Decoupling Between China and the U.S. - A Case Study of the Semiconductor Supply Chain

Ming Yan

DOI: https://doi.org/10.54097/ijeh.v10i3.11782

2023-09-14

International Journal of Education and Humanities

Abstract:Since the outbreak of Sino-US trade disputes in 2018, the game between China and the US has gradually changed from the field of trade to the field of science and technology. At the same time, with the global spread of the COVID-19 pandemic in 2020, global technological nationalism has risen rapidly and is spreading. In the context of most countries advocating localization and strategic autonomy of global supply chains, Part of countries have taken opposite measures. They use technological containment as their main means. Linking supply chains to national security. As an excuse to impose sanctions on China or cut off its supply chain to the semiconductor industry. Resulting in technological decoupling between China and the United States. It also affects the global production and supply chain layout of multinational companies. Therefore, this paper will take the semiconductor industry, the most representative in the global value chain, as a starting point to analyze how the United States, driven by the trend of technological nationalism, affects the technological decoupling between China and the United States.
Debate: Building a U.S. Regulatory Empire in the Chip War with China

John Krige

DOI: https://doi.org/10.1353/tech.2024.a940462

Abstract:Regulating the circulation of technology is a powerful weapon to exercise global power. In August 2022, U.S. president Joe Biden moved to strangle China's high-end semiconductor industry by imposing a swath of export controls aimed at restricting the country's access to global semiconductor supply chains. While this chip war is usually framed as a bilateral conflict between Washington and Beijing, the success of the U.S. strategy depends on the active cooperation of allied firms and governments. This article fills a critical gap in the standard narrative. It describes how the U.S. government has constructed an empire by regulation, leveraging its global political and economic power to impose extraterritorial export controls on allied trade. By seeking to regulate the flow of technology, knowledge, people, and foreign investment into China, the U.S. risks alienating traditional allies and has triggered China to seek self-sufficiency in the production of advanced semiconductors for civilian and military applications.
Editorial for the Special Issue on the Latest Advancements in Semiconductor Materials, Devices and Systems

Xinghuan Chen,Fangzhou Wang,Zirui Wang,Zeheng Wang,Jing-Kai Huang

DOI: https://doi.org/10.3390/mi15121422

IF: 3.4

2024-11-28

Micromachines

Abstract:The field of semiconductor research is experiencing a paradigm shift as the boundaries of Moore's Law are being approached [...]

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
State of the Art and Future Perspectives in Advanced CMOS Technology

Henry H. Radamson,Huilong Zhu,Zhenhua Wu,Xiaobin He,Hongxiao Lin,Jinbiao Liu,Jinjuan Xiang,Zhenzhen Kong,Wenjuan Xiong,Junjie Li,Hushan Cui,Jianfeng Gao,Hong Yang,Yong Du,Buqing Xu,Ben Li,Xuewei Zhao,Jiahan Yu,Yan Dong,Guilei Wang

DOI: https://doi.org/10.3390/nano10081555

IF: 5.3

2020-08-07

Nanomaterials

Abstract:The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
Analysis of the global trade network of the chip industry chain: Does the U.S.-China tech war matter?

Yongli Zhang,Xianduo Zhu

DOI: https://doi.org/10.1016/j.heliyon.2023.e17092

IF: 3.776

2023-06-11

Heliyon

Abstract:Chip is the "brain" of the information industry and modern manufacturing industry, and supply chain security is the key to the sustainable development of the industrial chain. From the perspective of the industrial chain, this paper selected semiconductor silicon wafers and equipment, integrated circuits, electronic computers, and components as representative commodities in the upstream, midstream, and downstream of the chip industry chain, constructed global trade networks of the chip industry chain, and analyzed the characteristics of the networks and nodes in 2020 and the changes in China's status before and after the China-U.S. tech war. The study results indicate that the network scale and network density of the global trade network of downstream electronic computers and components are higher than those of midstream integrated circuits; the global trade network of upstream semiconductor wafers and equipment has the smallest network scale and network density, and the trade networks of all links show obvious small-world characteristics; The United States ranks first in betweenness centrality of all links, with the strongest control ability and the largest number of trading partners in all links; China has higher betweenness centrality and more trading partners in the global trade network of the two upstream commodities than that of the midstream commodities, and the lowest betweenness centrality in the global trade network of the downstream commodities; The core countries of the chip industry chain are concentrated in southeast Asia, east Asia, central and western Europe, and the United States. China's trade status of semiconductor silicon wafers and integrated circuits has declined significantly during the China-U.S. tech war. The nodes in the chip trade network have good robustness in the face of random attacks and show vulnerability under target attacks. Additionally, the trade network's robustness in the chip industry chain is the strongest for downstream commodities, ranks second for midstream commodities, and is the weakest for upstream commodities. These findings can provide references for ensuring chip supply chain security in China and other trade-participating countries.
Computing With COOL Chips

Hsien-Hsin S. Lee

DOI: https://doi.org/10.1109/mm.2024.3354368

IF: 2.8212

2024-01-01

IEEE Micro

Abstract:In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.

computer science, software engineering, hardware & architecture
Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges

Konstantinos Rogdakis,George Psaltakis,Giorgos Fagas,Aidan Quinn,Rodrigo Martins,Emmanuel Kymakis

DOI: https://doi.org/10.1007/s43939-024-00074-w

2024-02-22

Discover Materials

Abstract:A new technological approach is needed for the development of emerging electronic components and systems within the Internet of Things (IoT) era. New advancements and innovations are required in architectural design and hybrid systems heterogeneous integration to address the challenge of widespread IoT deployment, its power demands and sustainability. Hybrid chips are one of the emerging technologies that can help overcome the current limitations in terms of energy consumption, performance and sustainability that could shape the future of electronic systems for targeted applications. Hybrid chips combine different materials and manufacturing technologies on the same substrate or package using advanced flexible heterogeneous integration techniques, with the focus of merging the advantages of each unit or technology toward enhanced performance and new levels of emerging functionalities. The categorization of hybrid chips spans across rigid hybrid chips that follow a multi-chiplet approach, semi-flexible chips that integrate flexible units with semi-rigid ones such as thinned silicon integrated circuits, and lastly, flexible chips in which all components are inherently flexible. This perspective article analyzes technical challenges that arise concerning the development of sustainable materials and processing technologies, complex heterogeneous integration, as well as advanced packaging architectures, standardization, and reliability testing. The economic implications for the semiconductor technology transition to hybrid chips is presented in terms of manufacturing costs, economic feasibility, and market readiness. Key insights and future application opportunities are provided, while recent advancements in the field are summarized. This perspective article suggests that by addressing these challenges, hybrid chips have the potential to transform electronic components and systems across a wide range of industries and use case scenario. The advancement of hybrid chip technologies by enhancing the collaboration between industry and academia as well as policymakers will be a crucial part in the realization of required sustainability goals within the worldwide Chips Act initiative, while ensuring the technological progress has the right balance between improved performance and sustainability.
Trending IC Design Directions in 2022

Chi-Hang Chan,Lin Cheng,Wei Deng,Peng Feng,Li Geng,Mo Huang,Haikun Jia,Lu Jie,Ka-Meng Lei,Xihao Liu,Xun Liu,Yongpan Liu,Yan Lu,Kaiming Nie,Dongfang Pan,Nan Qi,Sai-Weng Sin,Nan Sun,Wenyu Sun,Jiangtao Xu,Jinshan Yue,Milin Zhang,Zhao Zhang

DOI: https://doi.org/10.1088/1674-4926/43/7/071401

2022-01-01

Journal of Semiconductors

Abstract:For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.
Recent Progress of Integrated Circuits and Optoelectronic Chips

Hao Yue,Xiang Shuiying,Han Genquan,Zhang Jincheng,Ma Xiaohua,Zhu Zhangming,Guo Xingxing,Zhang Yahui,Han Yanan,Song Ziwei,Liu Yan,Yang Ling,Zhou Hong,Shi Jiangyi,Zhang Wei,Xu Min,Zhao Weisheng,Pan Biao,Huang Yangqi,Liu Qi,Cai Yimao,Zhu Jian,Ou Xin,You Tiangui,Wu Huaqiang,Gao Bin,Zhang Zhiyong,Origin Quantum Computing Company Limited,Chen Yonghua,Liu Yong,Chen Xiangfei,University of Chinese Academy of Sciences,Wang Xingjun,Zhao Lixia,Zou Xihua,Yan Lianshan

DOI: https://doi.org/10.1007/s11432-021-3235-7

2021-01-01

Science China Information Sciences

Abstract:Integrated circuits(ICs) and optoelectronic chips are the foundation stones of the modern information society. The IC industry has been driven by the so-called "Moore’s law" in the past 60 years, and now has entered the post Moore’s law era. In this paper, we review the recent progress of ICs and optoelectronic chips. The research status, technical challenges and development trend of devices, chips and integrated technologies of typical IC and optoelectronic chips are focused on. The main contents include the development law of IC and optoelectronic chip technology, the IC design and processing technology, emerging memory and chip architecture, brain-like chip structure and its mechanism, heterogeneous integration, quantum chip technology, silicon photonics chip technology, integrated microwave photonic chip, and optoelectronic hybrid integrated chip.

An Incoming World of Decoupling Siliconomy

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Special Issue on Hot Chips 2023

Semiconductor production, geopolitics and the CHIP SACT of 2022: a theoretical analysis

Can de-risking avert supply chain precarity in the face of China-U.S. geopolitical tensions? From sanctions to semiconductor resilience and national security

The Road for 2D Semiconductors in the Silicon Age (adv. Mater. 48/2022)

The future of two-dimensional semiconductors beyond Moore's law

Recent U.S. Government and foreign national government and commercial literature on semiconductors

Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security

The Economy–Security Nexus: Risk, Strategic Autonomy and the Regulation of the Semiconductor Supply Chain

China’s Counter-Strategy to American Export Controls in Integrated Circuits

Exploring the Global Trends in Semiconductor Supply Chain Development from the Perspective of US-China Relations

How Techno-Nationalism Affects Technological Decoupling Between China and the U.S. - A Case Study of the Semiconductor Supply Chain

Debate: Building a U.S. Regulatory Empire in the Chip War with China

Editorial for the Special Issue on the Latest Advancements in Semiconductor Materials, Devices and Systems

State of the Art and Future Perspectives in Advanced CMOS Technology

Analysis of the global trade network of the chip industry chain: Does the U.S.-China tech war matter?

Computing With COOL Chips

Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges

Trending IC Design Directions in 2022

Recent Progress of Integrated Circuits and Optoelectronic Chips