Rapid communication Microdeposition of metal and oxide structures using ultrashort laser pulses
I. Zergioti,S. Mailis,N. A. Vainos,P. Papakonstantinou,C. Kalpouzos,C. P. Grigoropoulos,C. Fotakis
1998-01-01
Abstract:Microdeposition of chromium metal and indium oxide microstructures via femtosecond KrF excimer laser (248 nm) ablation in a forward-transfer mode has been studied. The short pulse length, the short absorption length, and the consequently limited thermal diffusion, lower the ablation threshold and enable the deposition of high-definition features. Experiments carried out in a low-vacuum ( 0.1 Torr) environment result in highly reproducible, well-adhered structures of submicron size. Microdeposition of Cr and polycrystalline In2O3 on glass and silicon substrates is performed. The superior quality of the results allows the direct, one-step fabrication of binary-amplitude and multilevel optical diffractive structures. PACS: 81.15.F; 07.10.C; 42.40.J The laser-induced forward transfer (LIFT) technique [1] utilises pulsed lasers to remove thin film material from a transparent support and deposit it onto a suitable substrate. The thin film which is deposited onto a quartz plate is transferred by using a single laser pulse onto the receiving substrate usually placed parallel to the source thin film. The LIFT process was first shown by Bohandy et al. [1, 2] to produce direct writing of50-μm-wide Cu lines by using single ns excimer laser pulses ( 193 nm) under high vacuum (10−6 mbar). Fogarassy et al. [3, 4] have also reported 100-μm-width patterns of superconducting thin films using ns ArFandNd:YAG lasers. The deposition of diamond-like carbon films by the LIFT technique using a copper laser and a KrF laser was also reported [5]. Several other studies [6– 9] have resulted in direct writing of 20-μm-wide metal lines under air or helium ambient conditions also using ns laser pulses. The interface study of gold and aluminium deposition was also reported [10]. The dynamics of the laser ablation transfer (LAT) of 1-μm-thick coatings effected by near-IR (λ= 1064 nm) 23 pslaser pulses was studied by Sandy Lee et ∗ Department of Mechanical Engineering, University of California, Berkeley, California 94720, USA (E-mail: cgrigoro@euler.berkeley.edu) ∗∗ also Department of Physics, University of Crete al. [11] via an optical microscope with ps temporal resolution and showed that the velocity of the ejected material is Mach 0.75 and that the use of ps optical pulses results in a reduction of the laser fluence threshold by one order of magnitude, compared to that of 100-ns-long pulses. The ability to deposit patterns, spots, and lines, with subμm resolution may have applications in microelectronics as well as in the optoelectronics fabrication industries. Artificial texturing and engineering of sensitive parts is an effective approach for overcoming stiction problems in micro-electromechanical system (MEMS) surfaces, thereby improving tribological performance and component lifetime. Conventional methods of surface patterning are chemical vapour deposition (CVD), plasma CVD and sputtering, which by nature have no spatial selectivity. In this work we demonstrate, for the first time to our knowledge, direct microdeposition of high-quality patterns with sub-μm features. Metal and oxide structures are transferred usingfs ultraviolet radiation. The present approach exploits all advantages over conventional methods including simplicity in terms of vacuum handling, deposition purity, position selectivity, and high-accuracy subμm pattern transfer. 1 Experimental technique The materials used as the “target surface” in the microdeposition experiments were thin chromium and indium oxide films deposited on transparent quartz wafers. Cr films of 400, 800, and2000Å thickness were prepared by sputtering and e-beam evaporation and were uniform and well adhering. Thin films of In2O3 of 500Å to 4500Å in thickness were prepared by reactive pulsed laser deposition [12]. Glass (Corning type 7059) andSi(100)were used as “receiver surfaces”. The distance between the target and the receiver surfaces was variable from near-contact to1000μm with a 5-μm accuracy. The target–receiver pair was placed in a miniature vacuum cell, under a pressure of 10−1 mbar, driven by a rotary pump. The miniature cell was fixed onto a computer-controlled x− y translation stage, allowing a maximum 25 mm×25 mm