Experimental study on grinding 2.5D C/SiC composites by electroplated grinding wheel with ordered abrasive clusters
Ye Guo,Bing Chen,Xiaojing Fu,Hu Xu,Shiwei Sun
DOI: https://doi.org/10.1016/j.diamond.2024.110838
IF: 3.806
2024-02-01
Diamond and Related Materials
Abstract:To alleviate the problems of poor machining quality, short tool life, and low machining efficiency in the machining of 2.5D needled C/SiC composites, the bionic idea was adopted in this research, the heat dissipation performance of the windmill and the hydrophobic heat dissipation performance of the sunflower seeds were used to design two types of abrasive clusters ordered grinding wheels. The motion trajectory equation of single abrasive in the abrasive cluster of the grinding wheel end face was established, and the superposition motion trajectory of numerous abrasives in the abrasive clusters ordered grinding wheel was simulated. Through the grinding experiment of 2.5D needled C/SiC composites, the effects of ordered grinding wheels on surface roughness, microstructure, grinding force, grinding temperature and wear condition were investigated. The results demonstrated that the simulation results are compatible with the grinding marks left by the two types of ordered grinding wheels. Surface roughness, grinding force, and temperature all were improved to a considerable extent with both types of ordered grinding wheels. Compared to the disordered grinding wheel, type A and type B ordered grinding wheels can decrease the surface roughness of the C/SiC composite groove's bottom surface by 40.7 % and 35.8 % respectively. Additionally, they can reduce the grinding force F y by up to 68.3 % and 53.2 % respectively, and the grinding force F z by up to 70.4 % and 46.9 % respectively.
materials science, multidisciplinary,physics, applied, condensed matter, coatings & films