Research on key technology of ultrasonic temperature measuring instrument in high-temperature solid structure

Yue Cui,Jing Xiang,Dong Wei,Youan Shi,Yanxia Du,Yewei Gui
DOI: https://doi.org/10.1088/1742-6596/2366/1/012025
2022-11-12
Journal of Physics: Conference Series
Abstract:Aiming at the key technical requirements of ultrasonic measurement of internal temperature of high temperature solid structure, firstly, the mechanical structure of ultrasonic transducer is miniaturized and high-temperature resistant design is carried out, so that it can withstand the high temperature of 800°C. Meanwhile, the multi-waveform, multi-channel and multi-frequency excitation detection is achieved, and the integration of structure and function is realized. In addition, the high-speed data acquisition module adopts a 1GSPS sampling rate acquisition card combined with the phase-based acoustic time integral zero sub-measurement method to achieve the nanosecond acoustic time measurement accuracy required by ultrasonic temperature measurement. Finally, the reconstructed internal temperature field of steel structure is carried out by using the developed electromagnetic ultrasonic temperature measuring instrument and compared with the temperature measuring result of thermocouple, which verifies the reliability of high temperature resistant electromagnetic ultrasonic probe and high-speed acquisition module. The research shows that the integration of ultrasonic temperature measurement technology and the design and development of instruments will provide effective analysis methods, research means and testing tools for exploring the internal temperature parameters of structures.
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