CMOS-compatible integration of telecom band InAs/InP quantum-dot single-photon sources on a Si chip using transfer printing

Ryota Katsumi,Takeyoshi Tajiri,Kaur Ranbir,Johann Peter Reithmaier,Mohamed Benyoucef,Yasuhiko Arakawa,Yasutomo OTA,Satoshi IWAMOTO
DOI: https://doi.org/10.35848/1882-0786/acabaa
IF: 2.819
2022-12-16
Applied Physics Express
Abstract:We report hybrid integration of a telecom band InAs/InP quantum-dot (QD) single-photon source on a CMOS-processed Si photonics chip using transfer printing. The integration technique allows for the assemble of photonic components in a pick-and-place operation and therefore can introduce them on Si photonics chips after completing the entire CMOS-compatible fabrication processes. We demonstrate telecom single-photon generation from an InAs/InP QD integrated on Si and its coupling into a waveguide. We also demonstrate the integration of a QD on a fiber-pigtailed Si chip and single-photon output through the optical fiber, showing a novel pathway for modularizing solid-state quantum light sources.
physics, applied
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