Optimum strength and ductility of pure copper fabricated by Wire Arc Additive Manufacturing

Poonam S. Deshmukh,Krishna Tomar,G. Dan Sathiaraj,I.A. Palani,Poonam S. Deshmukh,Krishna Tomar,G. Dan Sathiaraj,I.A. Palani
DOI: https://doi.org/10.1016/j.mfglet.2022.06.005
2022-08-01
Manufacturing Letters
Abstract:The present study reports the feasibility of the Wire Arc Additive Manufacturing (WAAM) process to fabricate pure copper (Cu) wall structures. The process parameters that gave continuous tracks without any porosity and micro-cracks are used for layer-by-layer wall structure deposition. The scan and build direction have a UTS of 226.89 ± 4.28 MPa and 219.35 ± 1.41 MPa, along with an enhanced percentage elongation of 124.47 ± 8.65 % and 99.64 ± 16.47 %, respectively.
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