Development of Semiconductor Materials for Thermoelectric Cooling

A. K. Sreedhar,N. H. Godhwani,R. K. Purohit,W. N. Borle
DOI: https://doi.org/10.1080/03772063.1964.11485034
IF: 1.8768
1964-06-01
IETE Journal of Research
Abstract:Development of suitable materials for use in thermoelectric refrigeration is under progress. In this process the electrical resistivity and the seebeck coefficient of the solid solutions Bi2Te3 (80 per cent)+Bi2Se3 (20 per cent) and Bi2Te3 (26 per cent) + Sb2Te3 (74 per cent) as functions of AgI doping and of excess tellurium respectively have been studied. It is concluded that the bismuth telluride-bismuth selenide solid solution with 0·2 per cent AgI doping gives the best result as a n-type leg for thermoelectric refrigeration. The bismuth telluride antimony telluride solid solution with 4 per cent excess weight of tellurium is found to give the best results for the p-type leg. The best values for (α2σ) found is 30·6 × 10−4 V/ohm cm.°C. for the n-type and 58·1 × 10−4 V/ohm cm.°C. for the p-type. Some experiments on the contact resistance between the semiconductor and a copper plate have also been made.
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