Abstract:The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3centerdot1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5centerdot1015 1 MeV neqcm-2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design of the current ATLAS Pixel Detector sensor. The second approach of the new three dimensional (3D) silicon sensor technology benefits from the shorter charge carrier drift distance to the electrodes, which completely penetrate the sensor bulk. Prototype modules of both sensor concepts have been build and tested in laboratory and test beam environment before and after irradiation. Both concepts show very high performance even after irradiation to 5centerdot1015 1 MeV neqcm-2 and meet the IBL specifications in terms of hit efficiency being larger than 97%. Lowest operational threshold studies have been effected and prove independent of the used sensor concept the excellent performance of FE-I4 based module concepts in terms of noise hit occupancy at low thresholds.

The FE-I4 pixel readout system-on-chip resubmission for the insertable B-Layer project

Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

ATLAS IBL Pixel Upgrade

The FE-I4 Telescope for particle tracking in testbeam experiments

SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

Subpixel Mapping and Test Beam Studies with a HV2FEI4v2 CMOS-Sensor-Hybrid Module for the ATLAS Inner Detector Upgrade

Development of a FELIX based readout system for ITk strip hybrid module demonstrator for ATLAS Phase-II Upgrade

The Pixel Detector of the ATLAS experiment for the Run2 at the Large Hadron Collider

ATLAS IBL: a challenging first step for ATLAS Upgrade at the sLHC

Development of n-in-p pixel modules for the ATLAS Upgrade at HL-LHC

Development of Telescope Readout System Based on FELIX for Testbeam Experiments

Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

The LHCb VELO Upgrade II: Design and development of the readout electronics

A Study of the Latest Updates of the Readout System for the Hybird-Pixel Detector at HEPS

Development of FEB Test Platform for ATLAS New Small Wheel Upgrade

Performance of CMOS pixel sensor prototypes in ams H35 and aH18 technology for the ATLAS ITk upgrade

Performance of the ATLASPix1 Pixel Sensor Prototype in Ams Ah18 CMOS Technology for the ATLAS ITk Upgrade

Depleted fully monolithic CMOS pixel detectors using a column based readout architecture for the ATLAS Inner Tracker upgrade

Development of FEB Configuration Test Board for ATLAS NSW Upgrade.