Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings

A. Vicenzo,P.L. Cavallotti,P. Crema
DOI: https://doi.org/10.1080/00202967.2002.11871438
2002-01-01
Transactions of the IMF
Abstract:The present work is an investigation in to the possibility of promoting whisker growth on ECD tin coatings by means of an electrochemical treatment. Structure, morphology, and internal stresses of different ECD Sn films are determined and related to the observed susceptibility towards whisker growth; the substrate influence is also considered. Spontaneous whisker growth can be accelerated by a pulse reverse low current density treatment, aimed at stimulating the displacement exchange activity at the metal surface with a tin sulphate sulphuric acid solution. The results of this investigation show that, whilst solid state phenomena determine the growth rate, electrochemical conditioning at the surface can decrease the induction period, accelerating whisker nucleation. Surface sites electrochemically activated by the pulse reverse treatment can become preferential sites for whisker nucleation.
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