Abstract:Whisker formation is a frequently occurring problem in the electronica industry, causing damage to fine-pitch electrical components. Several theories and models have been developed to describe the whisker growth, and many attempts have been made to find solutions for this issue. Most of the previous literature addressed the formation of Sn whiskers, while some attention was focused on Bi-rich whiskers. Moreover, investigation of different types of whiskers would be beneficial for understanding of the fundamental processes behind of the whisker growth. In our work, we analyze and discuss the growth of Bi-rich whiskers in eutectic Sn58Bi solder coatings under isothermal aging conditions. A possible growth mechanism for Bi-whiskers in the coating is proposed. Two processes contributed to the whisker growth. One process was the chemical reaction between Cu and Sn atoms to form Cu6Sn5. Cu atoms were inexhaustibly introduced into the coating from the substrate and caused the formation of Cu6Sn5. This process provided the driving force and was a sufficient condition for the growth of Bi-rich whiskers. The second process was the segregation of Bi atoms driven by the gradient of the Bi atoms’ concentration. This process was the necessary condition for Bi-whiskers growth.

Whisker Mitigation Mechanisms in Indium-Doped Tin Thin Films: Role of the Surface

Abnormal Behaviors in Electrical Transport Properties of Cobalt-Doped Tin Oxide Thin Films

Single-Crystalline Tin-Doped Indium Oxide Whiskers: Synthesis and Characterization

Mitigation of Tin Whisker Growth by Inserting Ni Nanocones

Ni Barrier for Tin Whisker Mitigation

Effect of Interfacial Reaction on Tin Whisker Formation of Sn/Ni Films Deposited on Copper Lead-Frame

Tin whisker growth on bright Sn films supported by lead-frame alloy substrates

Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers

Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings

Tin Whisker Growth on Electroplated Sn Multilayers

Sn whisker growth mitigation by using NiO sublayers

Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling

The Influence of Non-Uniform Copper Oxide Layer on Tin Whisker Growth and Tin Whisker Growth Behavior in SnAg Microbumps with Small Diameter

Growth Behavior of Tin Whisker on SnAg Microbump under Compressive Stress

Growth Behavior of Tin Whisker and Hillock on Cu/Ni/SnAg Micro-Bumps under High Temperature and Humidity Storage

Inhibition of Tin Whisker by Electroplating Ultra-Thin Co-W Amorphous Barrier Layer

Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging

Method for inhibiting Sn whisker growth on Ti2SnC

Modification of Tin (Sn) Metal Surfaces by Surface Plasmon Polariton Excitation

Internal Microstructure Investigation of Tin Whisker Growth Using FIB Technology

Tin Whisker Formation on Electroless Tin Films Deposited on Lead-Frame Alloys