The Influence of Sodium Citrate and Potassium Sodium Tartrate Compound Additives on Copper Electrodeposition

Jiaqi Ni,
DOI: https://doi.org/10.20964/2017.07.57
IF: 1.541
2017-07-01
International Journal of Electrochemical Science
Abstract:The effects of sodium citrate and potassium sodium tartrate as compound additives on copper electrodeposition from a sulfuric acid solution were investigated using different electrochemical measurements, including linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry (CA). The LSV results revealed that the compound additives limited the hydrogen evolution reaction (HER) and impeded the reduction of copper ions on the surface of a vitreous carbon (VC) electrode. The CV results suggested that the deposition with or without additives was controlled by a diffusion-limited process. The real-time data of the current density vs. time obtained from CA implied that without the additives, the nucleation and growth mechanisms were relatively instantaneous three-dimensional (3D) diffusion controlled. Moreover, the presence of the compound additives did not change the mechanism. Their influence is that the additives absorbed on the electrode surface and/or complexed with the copper ions, inhibiting the reduction of the copper ions and reducing the rates of nucleation and growth.
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