Generation mechanism of interfacial layer and its effect on Fe-Cr-Ni/Al-Si-Cu-Ni-Mg composite performance

Lingzhan Zhou,Liming Yang,Xiurong Zhu,Yinjiang Peng
DOI: https://doi.org/10.1007/s11595-017-1730-7
2017-10-01
Abstract:Fe-Cr-Ni/Al-Si-Cu-Ni-Mg composite was taken as the experimental material. The chemical composition of interfacial layer was tested. The generation mechanism and influence of interfacial layer on the composite were analyzed. The results indicated that the generation of interfacial layer is sensitive to temperature. Interfacial layer will generate rapidly when temperature reaches 500 °C or above. The interfacial layer is mainly composed of Al, Si, Cu, Fe, and Cr, element Ni distributes at the outward of the interfacial layer for the precipitate of Ni later than Si and Cu, and there is almost no diffusion of Ni during the solution treatment. During heat treatment process, unequal quantity changing of metal atom results in disperse or concentrated vacancies or holes near the matrix. The existence of interfacial layer will induce a decrease of compression strength and plasticity at room temperature and an increase of strength at higher temperature comparing with composite without interfacial layer.
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