Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

Limin Zhang,Ning Li,Hui Xing,Rong Zhang,Kaikai Song
DOI: https://doi.org/10.1155/2018/6328976
2018-01-01
Advances in Condensed Matter Physics
Abstract:The effect of direct current (DC) on the wetting behavior of Cu substrate by liquid Ga–25In–13Sn alloy at room temperature is investigated using a sessile drop method. It is found that there is a critical value for current intensity, below which the decrease of contact angle with increasing current intensity is approximately linear and above which contact angle tends to a stable value from drop shape. Current polarity is a negligible factor in the observed trend. Additionally, the observed change in contact angles is translated into the corresponding change in solid-liquid interfacial tension using the equation of state for liquid interfacial tensions. The solid-liquid interfacial tension decreases under DC. DC-induced promotion of solute diffusion coefficient is likely to play an important role in determining the wettability and solid-liquid interfacial tension under DC.
physics, condensed matter
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