Abstract:Time-dependent plastic deformation, also known as creep, can occur in high-melting-point materials at room temperature when subjected to submicron plastic contact (e.g., components in micro-electronic mechanical systems) due to the extremely high stress conditions. Previous investigations of creep behavior at submicron scale mainly focus on uniform microstructures, whereas recently developed high-performance structural materials usually show complex microstructural heterogeneities. Here, we demonstrate a high-throughput nanoindentation approach to unveil the creep behavior of locally diverse microstructures, via a case study on an interstitial high-entropy alloy (iHEA). The prototype iHEA specimen was firstly pre-strained by severe cold-rolling to achieve diverse microstructure features including dense dislocations, nanotwins and nanograins. Nanoindentation mapping with 144 indents is conducted to collect creep data from all types of diverse microstructures, followed by systematical calculations based on power-law analysis. Then intuitive contour maps of nanohardness (H), strain rate (ε ̇) and stress exponent (n) are attained. The individual creep mechanism of each microstructure variant is evaluated by correlating local microstructure features with corresponding creep responses from these contour maps. With the increase of n value for different sample regions, the ε ̇ value inversely reduces and the corresponding dominant creep mechanism gradually converts from diffusion-mediated mode to dislocation-controlled one. The presence of nanograins and nanotwins significantly hinders dislocation interactions and promotes stress-induced diffusion. This work verifies that nanoindentation creep behavior is highly correlated with local microstructure features, and the mapping approach is feasible for evaluating creep-resistance of locally diverse microstructures under extremely high-stress conditions.

Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation

Experimental Determination of Mechanical Properties for Lead-Free Material SnAgCu

Inconsistent creep between dendrite core and interdendritic region under different degrees of elemental inhomogeneity in nickel-based single crystal superalloys

Anand Parameter Test for Pb-Free Material SnAgCu and Life Prediction for a CSP

In-situ study of creep in Sn-3Ag-0.5Cu solder

Steady-state nanoindentation creep test on β-Sn: A modified constant contact pressure method

Creep behavior of Sn–Bi solder alloys at elevated temperatures studied by nanoindentation

Effect of Nano-Intermetallic Compound on Creep Properties and β-Sn Grain Recrystallization of Cu/Sn–Ag–Cu/Ni Solder Joints

Effect of Ni content on the creep properties of Cu/Sn–0.3Ag–0.7Cu/Cu solder micro-joints

Micromechanical modelling of SnAgCu solder joint under cyclic loading: Effect of grain orientation

The Effect of Pressure and Orientation on Cu-Cu3Sn Interface Reliability under Isothermal Ageing and Monotonic Traction Via Molecular Dynamics Investigation

The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks

Nanoindentation creep behavior of diverse microstructures in a pre-strained interstitial high-entropy alloy by high-throughput mapping

The effect of grain orientation on nanoindentation behavior of model austenitic alloy Fe-20Cr-25Ni

Modelling of Ag3Sn coarsening and its effect on creep of Sn–Ag eutectics

Indentation Creep Behavior of Nano-Scale Ag/Co Multilayers

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

On the correlation between the stress exponent for creep determined by nanoindentation and the mechanism of action enabling stress relief in indium