Microstructural Evolution and Strengthening Behavior of High-Pressure Die-Cast High-Cu Al-Si-Cu-Mg Alloy with T5 Treatment

G. S. Peng,X. Y. Fu,Y. C. Gu,G. S. Song,S. S. Chen,Q. Q. Sun,W. D. Hua
DOI: https://doi.org/10.1007/s11665-022-06640-8
IF: 2.3
2022-02-11
Journal of Materials Engineering and Performance
Abstract:Conventional high-pressure die casts (HPDC) cannot be solution-treated at high temperature owing to the presence of air or gas in the alloy that may lead to the formation of undesired surface blistering. HPDC Al castings are typically subjected to T5 aging treatment (direct artificial aging after casting) to improve the mechanical properties. In this study, microstructural evolution and strengthening behavior of an HPDC Al-Si-Cu-Mg alloy with high Cu content aged by T5 treatment were investigated using electrical conductivity, hardness, and tensile tests combined with differential scanning calorimetry, x-ray diffraction, and scanning transmission electron microscopy characterization. Numerous dislocation tangles and nano-sized Si particles were observed in the HPDC Al castings. Most Cu dissolved into the Al matrix. An increase in hardness and electrical conductivity during the peak-aging treatment was attributed to formation of Guinier–Preston zones. Most dislocation tangles and nano-sized Si particles disappeared during further aging and Al2Cu precipitates formed, which led to a slight decrease in hardness and increase in electrical conductivity. The strengthening mechanism of over-aged HPDC alloys is attributed to precipitation of the equilibrium Al2Cu phase. HPDC alloys subjected to T5 aging treatment (175 °C for 420 min) exhibited the best mechanical properties: ultimate tensile strength, yield strength, and elongation reached 293 MPa, 212 MPa, and 3.1%, respectively.
materials science, multidisciplinary
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