Recent advancements in micro-crack inspection of crystalline silicon wafers and solar cells
Teow Wee Teo,Zeinab Mahdavipour,Mohd Zaid Abdullah
DOI: https://doi.org/10.1088/1361-6501/ab8088
IF: 2.398
2020-06-11
Measurement Science and Technology
Abstract:Due to the brittle nature of silicon, silicon-based crystalline solar cells are prone to micro-cracks from a variety of causes during the various stages of their manufacturing cycle. Undetected micro-cracks degrade the electrical performance of the photovoltaic (PV) modules, and hence reduce their expected service lifetime. Results from finite experimental analyses have revealed that the power loss due to micro-cracks can be as high as 60%, especially when they are formed in parallel with the bus bars [1]. Additionally, micro-cracks also weaken the structural integrity of a solar cell, and they can become a potential fire hazard because such defects can lead to the formation of thermal 'hot-spots' [2, 3]. As such, it is essential for solar cell manufacturers to detect and identify micro-cracks throughout the manufacturing process, and to remove defective samples from the production line as soon as they are detected [4, 5].Micro-cracks can be categorised based on their position. According to [6], micro-cracks that occur on the surface of a silicon wafer are of the facial or visible type. In contrast, micro-cracks that are located below the surface are known as subfacial or interior micro-cracks. Unlike the visible type of micro-cracks, the detection of interior micro-cracks poses a serious challenge since this type of defect is invisible to the naked eye. In the past, various specialised tools and instruments have been developed to solve this problem. Some recent techniques include light beam induced current (LBIC) [7], lock-in thermography (LIT) [8], resonance ultrasonic vibration (RUV) [9], scanning acoustic microscopy (SAM) [10], electroluminescence (EL) [11–15], photoluminescence (PL) [16–20] and optical transmission (OT) [21–25]. Good topical reviews on these subjects have been published elsewhere [26, 27]. For applications in a fully automated environment and in-line instrumentation, the authors of these reviews concluded that near-infrared (NIR)-based technologies such as EL, PL and OT offer the most practical solutions due to their speed advantage. Similarly, a more recent review reported the same findings, with EL and PL generally preferred for finished solar cells while OT is best suited for bare silicon wafers [28].However, since the publication of these papers, there have been several changes to the production process of a crystalline silicon solar cell in terms of production techniques and an increase in throughput speed. Changes in process include the silicon wafer sawing method, in which slurry-based slicing techniques are gradually being replaced by the state-of-the-art diamond-wire cutting technique. The latter produces much thinner wafers at higher speeds. The migration from slurry to diamond-wire sawing presented several new challenges to existing in-line micro-crack inspection methods in today's production environment.Previous review papers also did not consider the complexity of the images produced by existing luminescence systems, in particular EL and PL images. It is a well-known fact that images produced by these methods are very complex and defects can be obscured or misidentified as a result of unwanted interfering noise, which shares similar features to micro-cracks. This perspective article identifies these challenges and their effect on current inspection techniques, and highlights new potential breakthroughs that would impact today's micro-crack inspection process in manufacturing.The typical method of cutting silicon blocks to produce silicon wafers was previously based on the slurry wire-sawing technique, where the blocks are sliced by a smooth steel wire on which abrasive slurry is poured [29–32]. This results in silicon wafers with relatively rough surfaces with consistent textural uniformity. In recent years, the slurry wire-sawing technique has been gradually replaced by the new and more efficient -Abstract Truncated-
engineering, multidisciplinary,instruments & instrumentation