Abstract:Aluminum nitride (AlN) continues to kindle considerable interest in various microelectromechanical system (MEMS)-related fields because of its superior optical, mechanical, thermal, and piezoelectric properties. In this study, we use magnetron sputtering to tailor intrinsic stress in AlN thin films from highly compressive (-1200 MPa) to highly tensile (+700 MPa), with a differential stress of 1900 MPa. By monolithically combining the compressive and tensile ultrathin AlN bilayer membranes (20-60 nm) during deposition, perfectly curved three-dimensional (3D) architectures are spontaneously formed upon dry-releasing from the substrate via a 3D MEMS approach: the complementary metal-oxide-semiconductor (CMOS)-compatible strain-induced self-rolled-up membrane (S-RuM) method. The thermal stability of the AlN 3D architectures is examined, and the curvature of S-RuM microtubes and helical structures as a function of the cumulative membrane thickness and stress are characterized experimentally and simulated using a finite-element physiomechanic method. By combining AlN with various materials such as metal (Cu) and silicon nitride (SiNx), AlN-based hybrid S-RuM microtubes with diameters as small as ∼6 μm are demonstrated with a near-unity yield (∼99%). Compared with other stressed thin films for S-RuMs, including PECVD SiNx, magnetron-sputtered AlN-based S-RuMs show better structural controllability and versatility, probably due to the high Young's modulus and stress uniformity. This work establishes the sputtered AlN thin film as a superior stress-configurable S-RuM shell material for high-performance applications in miniaturizing and integrating electronic components beyond those based on other materials such as SiNx. In addition, for the first time, a single-crystal Al1-xScxN/AlN bilayer grown by molecular beam epitaxy is successfully rolled-up with the diameter varying from ∼9 to 14 μm, paving the way for 3D tubular Al1-xScxN piezoelectric devices.

Amorphous Silicon Self‐Rolling Micro Electromechanical Systems: From Residual Stress Control to Complex 3D Structures

Freestanding 3D Mesostructures, Functional Devices, and Shape‐Programmable Systems Based on Mechanically Induced Assembly with Shape Memory Polymers

Design, analysis, and characterization of stress-engineered 3D microstructures comprised of PECVD silicon oxide and nitride

Laser‐Guided Self‐Assembly of Thin Films into Micro‐Rolls

AFM Tip-Based Fabrication of Silicon Nanostructures with Reduced Subsurface Amorphous Layers

Post-CMOS Processing for High-Aspect-ratio Integrated Silicon Microstructures

Fabrication and Mechanical Cycling of Polymer Microscale Architectures for 3D MEMS Sensors

Self-Rolled-Up Aluminum Nitride-Based 3D Architectures Enabled by Record-High Differential Stress

Strain Engineering and Mechanical Assembly of Silicon/germanium Nanomembranes

Micromechanical Characterization of Polysilicon Films through On-Chip Tests

Post-CMOS Processing for High-Aspect-Ratio

Engineered Elastomer Substrates for Guided Assembly of Complex 3D Mesostructures by Spatially Nonuniform Compressive Buckling

Novel 3-D Device Fabrication Process in Micro-Electronic Mechanical System Based on Nano-Imprint Lithography

Mechanically Guided Assembly of Monolithic 3D Structures from Elastomer Composites.

Microfabrication Technology of Three-Dimensional Microdevices and Their Mems Applications

Residual Stress Study of SiO2/Pt/Pb(Zr,Ti)O3/Pt Multilayer Structure for Micro Electro Mechanical System Applications

An integrated push-to-pull micromechanical device: Design, fabrication, and in-situ experiment

Manufacturing of a Compact Micro Air Bearing Device for Power Micro Electro Mechanical System (MEMS) Applications Using Silica Film Assisted Processing

Fabrication and Deformation of 3D Multilayered Kirigami Microstructures.

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

Controlled mechanical assembly of complex 3D mesostructures and strain sensors by tensile buckling