MEMS-IC Robustness Optimization Considering Electrical and Mechanical Design and Process Parameters

Florin Burcea,Andreas Herrmann,Bing Li,Helmut Graeb
DOI: https://doi.org/10.1145/3325068
IF: 1.447
2019-07-24
ACM Transactions on Design Automation of Electronic Systems
Abstract:MEMS-based sensor circuits are traditionally designed separately using CAD tools specific to each energy domain (electrical and mechanical). This article presents a complete approach for combined MEMS-IC robustness optimization. Advanced methods for robustness analysis and optimization considering design, operating and process parameters, developed for integrated circuits, are transferred to MEMS-IC systems. Both electrical and mechanical design and process parameters are included in the optimization. The methodology is exemplified on two demonstrator examples: a MEMS microphone and a MEMS accelerometer, each with an integrated readout circuit. A successful optimization requires the simultaneous inclusion of design parameters and process tolerances from both energy domains. To save CPU time, a reduced-order, circuit-level model is used for the MEMS part and this model is created only when necessary. To integrate the generation of the simplified model into the optimization flow, a simulation-in-a-loop flow based on commercial tools for both the electrical and the mechanical domain has been implemented.
computer science, software engineering, hardware & architecture
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