Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board

Yan Hong,Xiangqing You,Yi Zeng,Yuanming Chen,Yunzhong Huang,Wei He,Shouxu Wang,Chong Wang,Guoyun Zhou,Xinhong Su,Weihua Zhang
DOI: https://doi.org/10.1016/j.vacuum.2019.108967
IF: 4
2019-12-01
Vacuum
Abstract:In this work, air plasma was employed to modify the surface of epoxy resin substrate for subsequent electroless copper plating. The influence of plasma modification on the interface performance of epoxy resin substrate was analyzed by multiple characterizations including morphological, chemical and surface tension-based measurements. The results show that the wettability and roughness of epoxy resin substrate are substantially increased after air plasma modification. The roughened shape and the oxidized chemical groups at surface are the major causes of modified interface properties of epoxy resin substrate. Subsequent electroless copper plating tests demonstrate that this air plasma treatment significantly improves the quality of copper deposition for printed circuit board manufacture.
materials science, multidisciplinary,physics, applied
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