DIC‐measurement during tensile testing and its approach for the FEM‐simulation of "Die‐Less‐Hydroforming"

Andreas Metzger,Daniel C. Ruff,Thomas Ummenhofer
DOI: https://doi.org/10.1002/pamm.201900443
2019-11-01
PAMM
Abstract:Digital Image Correlation (DIC)‐measurement is an optical measurement method which enables contactless and area‐wide continuous acquisition of 3D‐geometry, deformation and surface strain during experimental investigations. Within Die‐Less‐Hydroforming, an increasing innovative forming technology, see [1] and [2], the DIC‐measurement may be used for two tasks at once: The forming process of Die‐Less‐Hydroforming can be investigated continuously within the scope of the classical application of DIC in terms of geometry and deformation acquisition. However, this paper focuses on the use of DIC during the uniaxial tensile test of sheet metal used for manufacturing the double‐layered Die‐Less‐Hydroforming‐blank. Using DIC during the tensile test facilitates to measure the current cross‐section area continuously which allows the determination of a true stress‐true plastic strain‐curve. This curve is required as input for FEM‐forming‐simulation to achieve significant results. But with conventional testing methods, for the case of flat tensile test specimens, it cannot be determined beyond uniform strain Ag. Therefore, the “true” values beyond Ag are often estimated by mathematical approximations.
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